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A chip thermistor

A technology of thermistor and thermistor, applied in the direction of thermistor, resistor, non-adjustable metal resistor, etc., can solve the problems of easy failure, high construction failure rate, unfavorable storage and transportation, etc. Storage and storage, easy to use, and the effect of improving service life

Active Publication Date: 2022-05-17
四川特锐祥科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In the technical solutions disclosed above, they are all packaged during processing, which is prone to failure, and the overall construction failure rate is high, which is not conducive to storage and transportation

Method used

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  • A chip thermistor
  • A chip thermistor
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Embodiment Construction

[0030] The present invention will be further described below in conjunction with the accompanying drawings.

[0031] according to Figure 1-6 Shown: a kind of chip thermistor of the present invention is realized in this way, a kind of chip thermistor of the present invention: comprises encapsulation component, resistance element, and encapsulation component is transparent plastic film, and plastic film surface is coated with encapsulation Adhesive film 4, the resistance elements are divided into two groups, which are symmetrically embedded on the packaging component, and folded in half along the middle of the packaging component, the two groups of resistance elements are combined to form a resistance element;

[0032] The package assembly includes a package film 2, a package film 4, and a release film 5. The package film 2 is provided with a package film 4, the release film 5 is placed on the package film 4, and the package film 2 is provided with a side package Buckle 8, sid...

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PUM

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Abstract

The invention provides a chip thermistor, relates to a chip thermistor which is folded and packaged during use, and is convenient for transportation, and belongs to the field of electrical components. The provided method adopts two groups of resistance elements in front of the base material, and folds the base material to form a combination of resistance elements, and then combines the resistance body, and at the same time, the base material is packaged to form a thermistor, including packaging components, resistance elements , the packaging component is a transparent plastic film, and the surface of the plastic film is coated with a packaging film. The resistance elements are divided into two groups, which are symmetrically embedded on the packaging component. By folding in half along the middle of the packaging component, the two groups of resistance elements are combined to form a resistance element. The packaging component includes a packaging film, a packaging adhesive film, and a release film, and the resistance element includes an electrode and a thermistor body.

Description

technical field [0001] The invention provides a chip thermistor, relates to a chip thermistor which is folded and packaged during use, and is convenient for transportation, and belongs to the field of electrical components. Background technique [0002] At present, the existing thermistors are directly packaged, and the packaged structure is connected to electricity through two electrodes for temperature sensing and detection. The packaged thermistor is prone to damage during transportation and storage. Faults lead to subsequent use problems. In addition, the packaged thermistor is used in a single way and cannot be used in multiple forms. [0003] The notification number CN101022046B discloses a thermistor element, comprising a thermistor body and an anti-reduction coating covering the thermistor body, the thermistor body contains calcium calcium with a perovskite crystal structure represented by the chemical formula ABO3 Titanite phase, where A is at least one A-site elem...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01C7/00H01C1/02
CPCH01C7/008H01C1/02
Inventor 刘世军
Owner 四川特锐祥科技股份有限公司
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