The invention provides a chip thermistor, relates to a chip thermistor which is folded and packaged during use, and is convenient for transportation, and belongs to the field of electrical components. The provided method adopts two groups of resistance elements in front of the base material, and folds the base material to form a combination of resistance elements, and then combines the resistance body, and at the same time, the base material is packaged to form a thermistor, including packaging components, resistance elements , the packaging component is a transparent plastic film, and the surface of the plastic film is coated with a packaging film. The resistance elements are divided into two groups, which are symmetrically embedded on the packaging component. By folding in half along the middle of the packaging component, the two groups of resistance elements are combined to form a resistance element. The packaging component includes a packaging film, a packaging adhesive film, and a release film, and the resistance element includes an electrode and a thermistor body.