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Display panel, manufacturing method thereof and display device

A technology for display panels and display devices, which is applied to semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., can solve problems such as poor identification code accuracy, and achieve the effects of good accuracy and high reliability

Pending Publication Date: 2021-11-30
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Embodiments of the present disclosure provide a display panel, a manufacturing method thereof, and a display device, which can solve the problem of poor accuracy of panel identification codes formed in related technologies

Method used

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  • Display panel, manufacturing method thereof and display device
  • Display panel, manufacturing method thereof and display device
  • Display panel, manufacturing method thereof and display device

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Embodiment Construction

[0045] In order to make the purpose, technical solution and advantages of the present disclosure clearer, the present disclosure will be further described in detail below in conjunction with the accompanying drawings.

[0046] At present, in a display panel with a relatively simple structure (for example, a display panel applied in the vehicle field), the Panel ID code is generally formed by a source & drain metal (source&drain, SD) layer included therein. That is, refer to figure 1 Generally, the SD layer located on one side of the base substrate is coded and etched to form multiple grooves penetrating the SD layer, and the multiple grooves penetrating the SD layer are formed together with the uncoded etched SD layer Panel ID code. also, figure 1 Also shown is a passivation layer (passivation, PVX) on the side of the SD layer away from the base substrate.

[0047] However, due to the relatively thick thickness of the SD layer (generally 6000 angstroms), the relatively comp...

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Abstract

The invention provides a display panel, a manufacturing method thereof and a display device, and belongs to the technical field of display. The display panel comprises a semiconductor silicon material layer located between a source-drain metal layer and a passivation layer, and a plurality of grooves penetrating through the semiconductor silicon material layer and the passivation layer, and the plurality of grooves, the semiconductor silicon material layer and the passivation layer jointly form a panel identification code used for identifying the display panel. The semiconductor silicon material layer and the passivation layer are both non-metal material layers with relatively low thicknesses, so that the problems of over-etching and insufficient etching are not easy to occur when the semiconductor silicon material layer and the passivation layer are etched to form the groove. Furthermore, the precision of the formed panel identification code is relatively high, and the reliability of scanning the panel identification code to obtain the attribute information of the display panel is relatively high.

Description

technical field [0001] The present disclosure relates to the field of display technology, and in particular to a display panel, a manufacturing method thereof, and a display device. Background technique [0002] Currently, a panel identification (panel identify, Panel ID) code is generally formed on the display panel, and the Panel ID code can be scanned by a user to obtain attribute information (eg, production batch) of the display panel. [0003] In the related art, a display panel generally includes: a base substrate, and a source-drain metal layer and a passivation layer stacked in sequence on one side of the base substrate. The Panel ID code of the display panel is generally formed by the source-drain metal layer. That is, after the source-drain metal layer is deposited on one side of the base substrate, the source-drain metal layer in a partial area may be etched to form a Panel ID code. [0004] However, affected by the thickness of the source-drain metal layer and t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/544H01L27/12H01L27/32
CPCH01L23/544H01L27/1214H10K59/12
Inventor 刘莉刘全曹钦亚熊星杨钟
Owner BOE TECH GRP CO LTD