A kind of manufacturing method of multilayer trapezoidal blind groove printed board
A technology of multilayer printed boards and manufacturing methods, which is applied in multilayer circuit manufacturing, printed circuit manufacturing, printed circuits, etc., can solve problems such as deformation of multilayer printed boards, and achieve the effect of preventing deformation
Active Publication Date: 2022-02-01
四川英创力电子科技股份有限公司
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Problems solved by technology
In the prior art, square blind slots, cylindrical blind slots, etc. are more common, trapezoidal blind slots are relatively rare, and in the process of preparing blind slots, multi-layer printed boards are easily deformed when they are pressed together.
Method used
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Embodiment Construction
[0038] Such as Figure 11 As shown, this embodiment provides a method for manufacturing a multi-layer trapezoidal blind groove printed board, including the following steps:
[0039] S1. Preparatory stage: if Figure 8 As shown, after the first inner layer core board 11, the second inner layer core board 12, and the third inner layer core board 13 are cut, the inner layer circuit is made by coating ink, exposure, and etching for pattern transfer. The blind groove area of the inner core board 12 is hollowed out first, and then the hollow area is beveled according to a preset angle, wherein, the cross section of the blind groove of the second inner core board 12 is trapezoidal;
[0040] The first PP bonding sheet 21 and the second PP bonding sheet 22 are cut to a predetermined size, and the blind groove area of the first PP bonding sheet 21 is milled empty, wherein the blind groove area of the first PP bonding sheet 21 is The slot section is rectangular;
[0041] Such as...
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The invention discloses a method for manufacturing a multi-layer trapezoidal blind groove printed board, which includes the following steps: S1. Preparatory stage: emptying the blind groove area of the second inner layer core board first, and then aligning the blind groove area according to a preset angle The empty area is beveled; the blind groove area of the first PP adhesive sheet is milled empty; the PTFE gasket is cut into a preset shape; S2, pre-stacking: stack the inner core board and the PP adhesive sheet on the Together, the PTFE gasket is placed in the trapezoidal blind slot; S3, prepare the semi-finished multi-layer printed board: the pre-stacked board is pressed, drilled, copper / board electrical, outer circuit, pattern electroplating, Etching, anti-soldering, text, surface treatment; S4. Preparation of multi-layer trapezoidal blind groove printed board: use the emptying device to move the tray, and empty the blind groove area of the first inner core board, and take out the four trapezoidal blind grooves. Fluorine cloth gasket. Trapezoidal blind holes can be prepared on the multilayer printed board to prevent the deformation of the multilayer printed board when it is pressed and pressed.
Description
technical field [0001] The invention relates to the technical field of printed board preparation, in particular to a method for manufacturing a multilayer trapezoidal blind slot printed board. Background technique [0002] Printed boards, also known as printed circuit boards, printed circuit boards or printed circuit boards, use insulating boards as the base material, cut to a certain size, and realize the interconnection between electronic components through conductive patterns and hole structures. Blind groove is a relatively common structure in printed boards. It is mainly used to realize the input and output ports of electrical signals on each layer inside the printed board, as a cavity and carrier for pasting and mounting chips, capacitors, resistors and other components. As a channel for the interconnection of microwave components, it is cascaded through gold wires, gold ribbons, etc. In the prior art, square blind slots, cylindrical blind slots, etc. are more common,...
Claims
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IPC IPC(8): H05K3/46
CPCH05K3/4611H05K3/4697
Inventor 李清华牟玉贵张仁军杨海军邓岚胡志强
Owner 四川英创力电子科技股份有限公司