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Panel and spliced screen

A panel and substrate technology, applied in the display field, can solve problems such as obstacles to the development of MicroLED displays

Pending Publication Date: 2021-12-14
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the immaturity of mass transfer technology, the development of Micro LED displays in high resolution and large size has been hindered

Method used

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  • Panel and spliced screen
  • Panel and spliced screen
  • Panel and spliced screen

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Embodiment Construction

[0029] In order to enable those skilled in the art to better understand the technical solution of the present disclosure, the present disclosure will be described in further detail below in conjunction with the accompanying drawings and specific embodiments.

[0030] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure shall have the usual meanings understood by those skilled in the art to which the present disclosure belongs. "First", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Likewise, words like "a", "an" or "the" do not denote a limitation of quantity, but mean that there is at least one. "Comprising" or "comprising" and similar words mean that the elements or items appearing before the word include the elements or items listed after the word and their equivalents, without excluding other elements or items. Wo...

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Abstract

The invention provides a panel and a spliced screen, and belongs to the technical field of display. The panel comprises an array substrate, a connecting substrate and a driving circuit board. The array substrate comprises a first substrate, a plurality of signal lines and a plurality of side lines arranged in the peripheral area, the side lines are bent along at least one of the side surfaces, the side lines correspond to the signal lines one to one, one end of each side line is connected with one signal line, and the other end of each side wire is located on the second surface. The connecting substrate comprises a second substrate, a plurality of connecting pads and a plurality of bonding pads, one end of each connecting pad is connected with one bonding pad through a connecting line, and the other end of each connecting pad is connected with the other end of one side wire. The driving circuit board is arranged between the array substrate and the connecting substrate, and the driving circuit board is connected with the bonding pad.

Description

technical field [0001] The disclosure belongs to the field of display technology, and in particular relates to a panel and a splicing screen. Background technique [0002] At present, Micro Light Emitting Diode (Micro LED) display technology is developing rapidly. Due to its outstanding advantages: miniature size, low power consumption, high color saturation, fast response, long life, etc. Worker input into research. However, due to the immaturity of mass transfer technology, the development of Micro LED displays in high resolution and large size has been hindered. The capability of the existing mass transfer technology corresponds to TV-level and giant-screen display, and the seamless splicing display technology can make up for the deficiency of the current mass transfer technology to achieve large-screen display. In order to achieve truly seamless splicing in the Micro LED splicing display, it is necessary to use Side wiring (Side wiring) technology to lead the front sid...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/15H01L27/12G09F9/302
CPCH01L27/156H01L27/1214G09F9/302
Inventor 刘超冯莎王莉莉汪楚航王静贾明明翟明孙海威时凌云
Owner BOE TECH GRP CO LTD