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High-integrity system-on-chip for integrated modular avionics system

An avionics system, integrated modular technology, applied in the direction of electrical digital data processing, general-purpose stored program computer, architecture with a single central processing unit, etc., to improve integrity, good practical significance and application prospects, and ensure flight safety. Effect

Pending Publication Date: 2021-12-17
CHINESE AERONAUTICAL RADIO ELECTRONICS RES INST
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

However, the time overhead spent on synchronization between the processor's dual cores will be milliseconds or even tens of milliseconds

Method used

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  • High-integrity system-on-chip for integrated modular avionics system
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  • High-integrity system-on-chip for integrated modular avionics system

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Embodiment Construction

[0024] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments.

[0025] In the high-integrity system-on-a-chip used in the integrated modular avionics system shown in this embodiment, the functional modules of the system-on-chip are designed with dual redundancy to form the same first area and second area, so as to Take the first area as an example. The functional modules included are general-purpose processor core, ARINC 644 end system (End System, ES for short), CoreNet-based on-chip interconnection bus, and the on-chip interconnection bus is connected to the general-purpose processor core and ARINC 644 end system. , The ARINC 644 end system has full-duplex communication, and the communication rate supports 10 / 100Mbps double speed. The network MAC layer interface of the ARINC 644 end system adopts RMII, and the general-purpose processor core can communicate with external network devices through the on-chip...

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Abstract

The invention discloses a high-integrity system-on-chip for a comprehensive modular avionics system, which comprises a first area and a second area which are the same, and the first area and the second area both comprise functional modules including a universal processor core, a CoreNet-based on-chip interconnection bus, a delay module and an independent bus monitoring module; the delay module inserts bus delay of a clock period when the general processor core sends various signals on the on-chip interconnection bus to the bus monitoring module; the bus monitoring module compares the received signals of the first area and the second area one by one in clock cycles, and triggers a synchronous interrupt signal once an error is found; and the configuration, the read-write access state and the input and output addresses / data of the on-chip interconnection bus when the comparison fails are used as synchronous interruption information to be sent to the general processor core for processing. According to the invention, the internal synchronization of the dual-processor core is realized, and the data integrity is improved.

Description

technical field [0001] The invention relates to an integrated modular avionics system (Integrated Modular Avionics, referred to as IMA), aiming at the aviation data network (Aircraft Data Network, referred to as ADN), a high-integrity system-on-chip for the integrated modular avionics system is proposed. Background technique [0002] Civilian large transport aircraft have high requirements on the safety of avionics systems (referred to as avionics systems). Since the development of avionics system technology, it has evolved from a combined avionics system architecture to an integrated avionics system architecture, which is represented by the IMA system and the ADN-based switching network. Under this framework, how to ensure the safe operation of the entire IMA avionics system, so that the key parameters of the aircraft can be accurately transmitted and processed, and reduce the probability of pilot misoperation caused by erroneous data, so as to ensure flight safety is a cha...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F15/78
CPCG06F15/7807
Inventor 王嘉良
Owner CHINESE AERONAUTICAL RADIO ELECTRONICS RES INST
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