Integrated circuit board with plastic package structure for photovoltaic power supply
A technology of integrated circuit board and photovoltaic power supply, which is applied to the installation of printed circuit, circuit heating device, support structure, etc., which can solve the problems of inconvenient disassembly and assembly of integrated circuit board, and achieve the effect of improving convenience, strengthening strength and improving heat dissipation effect
Inactive Publication Date: 2021-12-31
绍兴华创光电科技有限公司
View PDF0 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0005] The object of the present invention is to provide an integrated circuit board for photovoltaic power supply with a plastic package structure to solve the defect that the existing integrated circuit board for photovoltaic power supply is inconvenient to disassemble
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0029] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
[0030] In the description of the present invention, it should be noted that unless otherwise specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. Connected, or integrally connected; it can be mechanically connected...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention relates to an integrated circuit board with a plastic package structure for a photovoltaic power supply, and the integrated circuit board comprises a housing, a circuit layer and a body. The body is arranged in the housing, a reinforcing structure is arranged in the body, a high-temperature-resistant layer is arranged outside the body, the circuit layer is arranged outside the high-temperature-resistant layer, and a second plastic package layer is arranged at the edge of the circuit layer. A first plastic package layer is arranged outside the second plastic package layer, a heat dissipation structure is arranged at the top end of the surface of the circuit layer, mounting structures are arranged at the corners of the top end and the bottom end of the first plastic package layer, connecting blocks are arranged on the two sides of the top end and the bottom end of the first plastic package layer, and limiting grooves are embedded in the connecting blocks. According to the invention, the mounting structure is arranged, the stop block is extruded to move into the insertion rod, the spring is in a contraction state, and after the insertion rod is rotated at a proper position in a later period, the stop block extends outwards through the spring and is clamped into the clamping groove at one side of the installation slot, so that the convenience of dismounting and mounting the integrated circuit is improved.
Description
technical field [0001] The invention relates to the technical field of integrated circuit boards, in particular to an integrated circuit board for photovoltaic power supply with a plastic package structure. Background technique [0002] The integrated circuit board is a carrier for carrying integrated circuits. The electrical components required by the formed circuit are installed on it and connected through corresponding connecting wires to form the entire integrated circuit. The integrated circuit board continues to develop with society. Its quality is also constantly improving; [0003] The current integrated circuit board for photovoltaic power supply still has the following defects when in use: it usually needs to be connected by fastening screws at the corner of the surface during use, which makes disassembly and assembly inconvenient. Contents of the invention [0004] (1) Technical problems to be solved [0005] The object of the present invention is to provide a...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/14H05K1/02
CPCH05K7/1405H05K7/1404H05K1/0203H05K1/021H05K1/0271
Inventor 刘一锋
Owner 绍兴华创光电科技有限公司