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Device for measuring force exerted on object

A technology of objects and equipment, applied in the field of using the equipment, can solve the problems that CFM does not allow contact detection, does not provide a particularly satisfactory solution, and has low flexibility

Pending Publication Date: 2021-12-31
ECOLE POLYTECHNIQUE FEDERALE DE LAUSANNE (EPFL)
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, CFM has some disadvantages: firstly, CFM is not suitable for applications requiring force characterization, and secondly, CFM also does not allow contact detection
Optical methods, on the other hand, require sensitive signal conditioners and optical fibers integrated into custom probe tips that are less flexible than electrical connections
[0010] In general, the prior art does not provide a particularly satisfactory solution when it comes to micro / nanoscale applications for submilliNewton force measurements, either because the prior art requires the use of specific needles or because current Technological means dealing with complex instruments limited to specific applications

Method used

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  • Device for measuring force exerted on object
  • Device for measuring force exerted on object
  • Device for measuring force exerted on object

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Embodiment Construction

[0061] This detailed description is intended to illustrate the invention in a non-limiting manner, since any feature of an embodiment may be combined in an advantageous manner with any other feature of a different embodiment.

[0062] Figure 1 to Figure 3 Different embodiments of a device 100, 200, 300 according to the invention are represented. First, before describing each embodiment in detail, a general description of the apparatus 100, 200, 300 will be provided.

[0063] The device 100, 200, 300 comprises a rod 101, 201, 301 on which is fixed a probe 102, 202, 302 designed to contact an object 103, 203, 303 and to A force exerted on an object is called a contact force. The lever 101 , 202 , 301 is pivotally coupled to a main body 104 , 204 , 304 which is coupled to a mount 105 , 205 , 305 . The body 104 , 204 , 304 and the rod 101 , 202 , 301 are movable relative to the mount 105 , 205 , 305 , while said mount is immovable relative to the object 103 , 203 , 303 .

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PUM

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Abstract

The present invention relates to a device for measuring a contact force exerted by an object on a probe comprising a lever and said probe for contacting the object. The lever is pivotably coupled to a body by coupling means. The device comprising a fixed frame coupled to the body. The body is designed to be moved with respect to the object to put the probe in contact with the object to create a force pivoting said lever with respect to the body around a pivot axis, for instance a torque rotating said lever. The device comprising a sensor for measuring the displacement of the lever with respect to the body upon pivoting. The coupling means comprise control stiffness means, for instance an elastic element, so that when the probe contacts the object, the displacement of the lever is proportional to the force exerted by the probe on the object. Such control stiffness means are tunable so that the accuracy and sensitivity of the measured force is controlled. The invention further relates to a method for using the device according to the invention.

Description

technical field [0001] The invention relates to a device for measuring a contact force exerted by a probe on an object. The invention also relates to methods of using the device. Background technique [0002] Different methods have been announced, in particular for manipulating semiconductors or biological materials, using robotic systems to control the contact between a probe and an object, also called automatic probe landing. [0003] The first method developed was adapted from known mechano-macroscale techniques. In the paper "Sensor-Based Robot Transformation Control Strategies" from Y.F. Li. The International Journal of Robotics Research 15, 128-136, 1996, the authors combined proximity sensors with force sensors placed near the tip of the probe. The paper from P.H.J. Schellekens et al. "For 3-D In "Silicon Etched Probes for Coordinate Measurement," a bending mechanism is fabricated to measure the 3D deflection of the probe in contact with the sample. However, these...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01L5/00G01N3/40G01Q60/24
CPCG01L5/009G01N3/40G01L5/0042
Inventor M·H·卡罗拜扬C·鲍尔S·海宁M·扎纳蒂
Owner ECOLE POLYTECHNIQUE FEDERALE DE LAUSANNE (EPFL)