Exposure method and exposure device

Abstract

The invention discloses an exposure method and an exposure device. The exposure method comprises the following steps: extracting an exposure rule of a first-layer pattern or a front-layer pattern of each wafer in a current wafer group, wherein the exposure rule comprises a corresponding relationship between a wafer number and a bearing table; obtaining the number of at least one vacant wafer in the current wafer group according to the actual exposure information of the current layer pattern of each wafer in the current wafer group; removing the number of at least one vacant wafer in the exposure rule of the current-layer pattern, sequentially moving the wafer numbers of the numbers of the vacant wafers forward after the corresponding arrangement sequence of the same bearing table, and supplementing the vacant positions of the numbers to obtain the exposure rule of the current-layer pattern; and exposing the current-layer pattern of each wafer in the current wafer group according to the exposure rule of the current-layer pattern. According to the technical scheme provided by the embodiment of the invention, the condition of no load of the bearing table is avoided, and the productivity of the exposure machine is improved.

Description

technical field [0001] Embodiments of the present invention relate to the technical field of photolithography, and in particular, to an exposure method and an exposure device. Background technique [0002] The exposure machine can project the pattern on the photomask onto the substrate coated with photoresist, so that the film layer on the substrate can be patterned through subsequent developing and etching processes. At present, exposure machines have been widely used in the field of integrated circuit manufacturing. [0003] In the prior art, the exposure machine sequentially exposes the wafers in the wafer group according to the preset sequence. When there is a vacant wafer in the wafer group, no wafer is placed on the carrier table of the exposure machine corresponding to the vacant wafer. Exposure results in shorter effective exposure time of the exposure machine, a reduction in the number of exposed wafers per unit time, and a decrease in the production capacity of th...

AI Technical Summary

Problems solved by technology

[0003] In the prior art, the exposure machine sequentially exposes each wafer in the wafer group according to the preset sequence. When there is a vacant wafer in the wafer group, the vacancy No wafer is exposed on the carrier table of the exposure machine corresponding to the wafer, resulting in a shorter effective exposure time of the exposure machine, a decrease in the number of exposed wafers per unit time, and a decrease in the production capacity of the exposure machine

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