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BGA packaging method

A packaging method and technology for packaging devices, which are used in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of reduced production rate, reduced production capacity, difficult positioning of substrates, etc. The effect of reducing the production rate

Pending Publication Date: 2022-01-11
QINGDAO GOERTEK MICROELECTRONICS RES INST CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This results in increased production costs in packaged products
[0004] In the BGA packaging process involving the use of high-temperature resistant UV glue to fix devices, the cost of high-temperature resistant UV glue materials is high
It is difficult to position the substrate fixed on the UV glue during the cutting process, and a large number of glue filaments will be generated, which will affect the accurate progress of the subsequent process
And it will lead to lower production rate and lower capacity

Method used

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Examples

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Embodiment Construction

[0037] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

[0038] The following description of at least one exemplary embodiment is merely illustrative in nature and in no way taken as limiting the invention, its application or uses.

[0039] Techniques, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods and devices should be considered part of the description.

[0040] In all examples shown and discussed herein, any specific values ​​should be construed as exemplary only, and not as limitations. Therefore, other instances of the exemplary embodiment may have dif...

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PUM

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Abstract

The invention discloses a ball grid array (BGA) packaging method, which comprises the following steps of: preparing a single-sided adhesive tape; laying a plurality of packaging devices on the single-sided adhesive tape; embedding the pin of each packaging device into the single-sided adhesive tape; packaging the plurality of packaging devices; and separating the single-sided adhesive tape from the packaging devices. The BGA packaging method has the advantages that: the pins of the packaging devices are embedded into the single-sided adhesive tape, the packaging devices are packaged on the single-sided adhesive tape, the single-sided adhesive tape can adapt to packaging devices of different sizes, the manufacturing cost is reduced, the packaging device does not need to be cut and separated, the process steps are simple, the production rate is not reduced, and the problem of reducing the productivity is avoided.

Description

technical field [0001] The present invention relates to the technical field of BGA packaging, and more specifically, to a BGA packaging method. Background technique [0002] At present, in order to meet the requirements of packaging technology development, devices are packaged using BGA packaging technology. The existing BGA packaging process has many disadvantages. [0003] In the BGA packaging process of using double-sided adhesive to fix the device, the double-sided adhesive needs to be fixed on the tool corresponding to the device structure, and the double-sided adhesive needs to be opened corresponding to the tool. In such a process, there are few devices suitable for each tool, and it is necessary to match and set a separate tool structure to package different devices. This causes an increase in production cost in packaged products. [0004] In the BGA packaging process involving the use of high temperature resistant UV glue to fix devices, the cost of high temperat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/56H01L21/67H01L21/683
CPCH01L21/6836H01L21/67121H01L21/67126H01L21/568
Inventor 孙唯超韩旭李骞
Owner QINGDAO GOERTEK MICROELECTRONICS RES INST CO LTD