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Semiconductor package

A semiconductor and packaging technology, applied in the field of semiconductor packaging, can solve problems such as warping of thermal expansion coefficient semiconductor packaging

Pending Publication Date: 2022-01-11
SAMSUNG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, differences in thermal expansion coefficients between different materials in a semiconductor package may cause warping of the semiconductor package

Method used

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  • Semiconductor package
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Embodiment Construction

[0023] Hereinafter, example embodiments of the inventive concepts will be described with reference to the accompanying drawings.

[0024] figure 1 is a cross-sectional view illustrating a semiconductor package 100a according to an example embodiment of the inventive concepts, and figure 2 is showing figure 1 A plan view of the upper surface of the semiconductor package 100a.

[0025] refer to figure 1 and figure 2 , the semiconductor package 100 a may include a substrate 110 , a semiconductor chip structure 120 and a stiffener 130 . In addition, an underfill resin 22 between the substrate 110 and the semiconductor chip structure 120 may also be included.

[0026] The substrate 110 is a supporting base on which the semiconductor chip structure 120 and the stiffener 130 are mounted. The substrate 110 may include a pad 13 a disposed on a lower surface S1 of the substrate 110 and a pad 13 b disposed on an upper surface S2 of the substrate 110 . In addition, the substrate ...

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Abstract

A semiconductor package includes a substrate including a wiring, a semiconductor chip structure on the substrate, and electrically connected to the wiring, an underfill resin in a space between the substrate and the semiconductor chip structure, and a stiffener surrounding the semiconductor chip structure, on the substrate, wherein the stiffener includes a conductive frame having a cavity and an insulating filler in the cavity.

Description

[0001] This application claims priority and benefit from Korean Patent Application No. 10-2020-0085204 filed with the Korean Intellectual Property Office on July 10, 2020, the entire contents of which are hereby incorporated by reference. technical field [0002] The present disclosure relates to semiconductor packages. Background technique [0003] According to the trend of miniaturization and high performance of semiconductor chips, in the field of semiconductor packaging, a system-in-package (SIP) technology of embedding a plurality of semiconductor chips in a single package is being developed. However, differences in coefficients of thermal expansion between different materials in a semiconductor package may cause warping of the semiconductor package. Contents of the invention [0004] An aspect of the inventive concept is to provide a semiconductor package having improved warpage at room temperature and high temperature. [0005] According to an aspect of the inventi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/31H01L23/498
CPCH01L23/3107H01L23/49861H01L23/49816H01L23/367H01L23/49827H01L23/562H01L23/16H01L23/04H01L2224/16227H01L2224/32225H01L2224/73204H01L2924/15311H01L2924/15192H01L2224/73253H01L2224/16145H01L2224/16146H01L2924/18161H01L2924/3511H01L25/0655H01L25/0652H01L2225/06513H01L2225/06517H01L2225/06541H01L25/18H01L2225/06589H01L24/16H01L2224/16225H01L2924/00H01L23/31H01L23/29H01L23/13H01L23/525H01L23/481H01L23/3185H01L23/3675H01L23/49838
Inventor 金喆禹郑阳圭南秀铉
Owner SAMSUNG ELECTRONICS CO LTD