Inspection method of array substrate, display device and inspection jig

Abstract

The invention provides an inspection method of an array substrate, a display device and an inspection jig, which can well inspect the characteristics of an array substrate on which light-emitting elements are not mounted. The inspection method of an array substrate comprises the following steps: preparing an array substrate on which a plurality of light-emitting elements are not mounted; using an inspection jig including a first connection terminal, a second connection terminal, and an inspection capacitor provided between the first connection terminal and the second connection terminal, connecting the first connection terminal to a mounting electrode, and connecting the second connection terminal to a pixel cathode electrode; and supplying an inspection signal to a transistor on the basis of a control signal from an inspection control circuit that controls inspection of the array substrate, and detecting an output signal output from the transistor in accordance with the inspection signal.

Description

technical field [0001] The invention relates to an inspection method of an array substrate, a display device and an inspection fixture. Background technique [0002] A display device using a micro-sized light-emitting diode (micro LED (micro LED)) as a display element is attracting attention (for example, refer to Patent Documents 1 and 2). Display devices using light emitting diodes are difficult to manufacture such as mounting the light emitting diodes on a substrate due to the small size of the light emitting diodes, which easily leads to failure of the light emitting diodes. Patent Document 1 describes a method of inspecting a plurality of LEDs formed on a sapphire substrate. In addition, Patent Document 2 describes an inspection method for detecting threshold voltages of pixels in real time. [0003] Patent Document 1: Japanese Patent Laid-Open No. 2019-78685 [0004] Patent Document 2: Specification of US Patent Application Publication No. 2017 / 0103702 [0005] In ...

AI Technical Summary

Problems solved by technology

[0005] In the case of inspection after mounting multiple light-emitting elements on the array substrate, if defects are found in the circuits and wiring of the array substrate, the mounted multiple light-emitting elements may also be discarded

In Patent Documents 1 and 2, there is no description of an inspection method for the electrical characteristics of an array substrate on which no light-emitting elements are mounted.

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