Display substrate, preparation method thereof and display device

A display substrate and display area technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, diodes, etc., can solve the problems of difficult alignment between display substrate and flexible printed circuit board, and achieve the effect of solving difficult alignment

Pending Publication Date: 2022-01-21
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Embodiments of the present disclosure provide a display substrate, a preparation method thereof, and a display device, so as to solve the problem of difficult alignment between the existing display substrate and the flexible printed circuit board

Method used

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  • Display substrate, preparation method thereof and display device
  • Display substrate, preparation method thereof and display device
  • Display substrate, preparation method thereof and display device

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Embodiment Construction

[0041] The application describes a number of embodiments, but the description is illustrative rather than restrictive, and it will be obvious to those of ordinary skill in the art that within the scope of the embodiments described in the application, There are many more embodiments and implementations. Although many possible combinations of features are shown in the drawings and discussed in the detailed description, many other combinations of the disclosed features are possible. Except where expressly limited, any feature or element of any embodiment may be used in combination with, or substituted for, any other feature or element of any other embodiment.

[0042] This application includes and contemplates combinations of features and elements known to those of ordinary skill in the art. The disclosed embodiments, features and elements of this application can also be combined with any conventional features or elements to form unique inventive solutions as defined by the clai...

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Abstract

A display substrate comprises a silicon-based substrate and a first color film layer arranged on the silicon-based substrate, the silicon-based substrate is provided with a display area and a peripheral area located on the periphery of the display area, and the peripheral area comprises a binding area located on one side of the display area; the first color film layer is located in the peripheral area, the first color film layer comprises at least one color adhesive layer, each color adhesive layer is provided with a hollow structure, the first color film layer comprises at least one first alignment mark, and the first alignment mark is formed by the hollow structure of at least one color adhesive layer; and the orthographic projection of the first alignment mark on the silicon-based substrate is located between the display area and the binding area in the second direction.

Description

technical field [0001] Embodiments of the present disclosure relate to but are not limited to the field of display technology, especially a display substrate, a manufacturing method thereof, and a display device. Background technique [0002] Micro-OLED (Micro Organic Light-Emitting Diode) is a micro-display developed in recent years, and silicon-based organic light-emitting diode (OLED, Organic Light-Emitting Diode) is one of them. In the manufacturing process of silicon-based OLED display products, it is often necessary to bind and connect the display substrate and the flexible printed circuit board, but there is a problem of difficult alignment between the display substrate and the flexible printed circuit board, which greatly affects the yield of the product . Contents of the invention [0003] The following is an overview of the topics described in detail in this article. This summary is not intended to limit the scope of the claims. [0004] Embodiments of the pre...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/32H01L51/56
CPCH10K59/38H10K71/00
Inventor 魏俊波杨盛际卢鹏程黄冠达田元兰刘伟李云龙朱志坚杨子筠
Owner BOE TECH GRP CO LTD
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