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Burn-in test equipment

A test equipment and burn-in technology, applied in the direction of environment/reliability test, measuring electricity, measuring device, etc., can solve the problems of low burn-in production capacity, large oven site area, etc., achieve low processing cost, fast installation and maintenance, The effect of simple overall structure design

Pending Publication Date: 2022-01-25
SHANGHAI FUDAN MICROELECTRONICS GROUP
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

On the one hand, due to the limitation of the internal space of the oven, the number of aging devices that can be accommodated in a single batch of aging test process is small; on the other hand, the oven occupies a large area, and the aging capacity per unit area is low

Method used

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  • Burn-in test equipment

Examples

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Embodiment Construction

[0051] The existing aging test equipment is basically designed based on a closed high-temperature oven. The existing temperature-controlled fixtures for aging are only used in high-temperature oven-type aging testing equipment. On the one hand, due to the limitation of the internal space of the oven, the number of aging devices that can be accommodated in a single batch of aging test is small. On the other hand, the oven occupies a large area, and the aging capacity per unit area is low.

[0052] Different from the prior art, in the technical solution provided by the embodiment of the present invention, the burn-in test equipment includes: a bracket with multiple layers of first platforms; each layer of first platforms detachably arranged in the multi-layer first platforms The chassis is supported by a bracket; at least one burn-in slot module is arranged in the chassis; wherein, each burn-in slot module in at least one burn-in slot module includes at least one temperature zon...

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Abstract

The embodiment of the invention provides burn-in test equipment. The burn-in test equipment comprises: a bracket with a plurality of layers of first platforms; a case which is detachably arranged on each layer of first platform in the plurality of layers of first platforms, wherein the case is supported by the bracket; at least one burn-in slot is arranged in the case, wherein each burn-in slot in the at least one burn-in slot comprises at least one temperature zone sub-module, and each temperature zone sub-module in the at least one temperature zone sub-module is used for carrying out a burn-in test on the device to be tested. Compared with the prior art, the burn-in test equipment provided by the embodiment of the invention has the open shelf structure, the burn-in load plate is inserted into the burn-in slot of each layer of the shelf structure to realize burn-in of the to-be-tested devices, and the number of the to-be-tested devices is not limited by the volume of a traditional oven; and the number of devices to be tested and the utilization rate of a site in a single-batch burn-in test are greatly improved.

Description

technical field [0001] The invention relates to the technical field of burn-in testing, in particular to burn-in testing equipment. Background technique [0002] The existing aging test equipment is basically designed based on a closed high-temperature oven. The existing temperature-controlled fixtures for aging are only used in high-temperature oven-type aging testing equipment. On the one hand, due to the limitation of the internal space of the oven, the number of aging devices that can be accommodated in a single batch of aging test is small. On the other hand, the oven occupies a large area, and the aging capacity per unit area is low. Contents of the invention [0003] An embodiment of the present invention provides a burn-in testing device, comprising: a bracket with a multi-layer first platform; a chassis detachably arranged on each layer of the first platform in the multi-layer first platform, the chassis is supported by the bracket; At least one burn-in slot mod...

Claims

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Application Information

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IPC IPC(8): G01R31/00G01R1/04
CPCG01R31/003G01R1/0408
Inventor 王延政周培周军詹超石彬彬宫鹏鹏季培成
Owner SHANGHAI FUDAN MICROELECTRONICS GROUP