Three-dimensional sensing module, manufacturing method thereof and electronic device

A technology of three-dimensional sensing and manufacturing methods, which is applied in the fields of electrical digital data processing, instruments, coatings, etc., can solve the problems that three-axis electrodes cannot have flexible characteristics at the same time, and can not achieve flexible assembly, so as to reduce the thickness Effect

Pending Publication Date: 2022-01-25
TPK ADVANCED SOLUTIONS
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the known technology proposed by the existing industry has the following problems in the pressure sensor mounted on the touch module: (1) The X-Y-Z three-axis electrodes cannot simultaneously have flexible properties and cannot be used as a flexible assembly ; and (2) only a local area has a Z-axis sensing function

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Three-dimensional sensing module, manufacturing method thereof and electronic device
  • Three-dimensional sensing module, manufacturing method thereof and electronic device
  • Three-dimensional sensing module, manufacturing method thereof and electronic device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0045] A number of embodiments of the present invention will be disclosed below with the accompanying drawings. For the sake of clarity, many practical details will be described together in the following description. It should be understood, however, that these practical details should not be used to limit the invention. That is, in some embodiments of the present invention, these practical details are unnecessary. In addition, for the sake of simplifying the drawings, some known and conventional structures and elements will be shown in a simple and schematic manner in the drawings.

[0046] Please refer to figure 1 as well as figure 2 . figure 1 It is a schematic diagram illustrating an electronic device 100 according to an embodiment of the present invention. figure 2 for illustration figure 1 A partial perspective view of some components of the electronic device 100 in FIG. Such as figure 1 and figure 2 As shown, the electronic device 100 of this embodiment is an...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
lengthaaaaaaaaaa
Login to view more

Abstract

The invention discloses a three-dimensional sensing module, a manufacturing method thereof and an electronic device. The three-dimensional sensing module comprises a touch pressure sensing structure. The touch pressure sensing structure comprises a first functional interlayer, a first light-transmitting electrode layer coated on the first functional interlayer, a second functional interlayer coated on the first light-transmitting electrode layer, a second light-transmitting electrode layer coated on the second functional interlayer, and a third functional interlayer coated on the second light-transmitting electrode layer. The resistivity of the first, second and third functional interlayers is greater than the resistivity of the first and second light-transmitting electrode layers. Compared with a known complicated manufacturing method that the touch module and the display module need to be manufactured separately and then glued, the manufacturing process of the three-dimensional sensing module can completely omit the use of bonding glue, so that multiple gluing processes and the thickness of the bonding glue can be reduced, and the thin design of the three-dimensional sensing module is realized.

Description

technical field [0001] The invention relates to a three-dimensional sensing module, its manufacturing method and electronic device. Background technique [0002] With the diversified development of the touch module, it has been maturely applied in industrial electronics and consumer electronics products. From the need to determine the two-dimensional position of the touch point on the surface of the screen (for example, the X-axis direction and the Y-axis direction) to the requirement for sensing the force change applied to the screen surface (for example, the Z-axis direction) The strength parameter requirements. Even, it will be inevitable to meet the application requirements of flexible panels. [0003] However, the known technology proposed by the existing industry has the following problems in the pressure sensor mounted on the touch module: (1) The X-Y-Z three-axis electrodes cannot simultaneously have flexible properties and cannot be used as a flexible assembly ; ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): G06F3/041C09D127/16
CPCG06F3/0414C09D127/16G06F2203/04103G06F3/0416G06F3/0412H01B1/02
Inventor 李联鑫王仁宏叶财金林伟義郑太狮魏财魁庄志成林松柏
Owner TPK ADVANCED SOLUTIONS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap