35results about How to "Realization of thin design" patented technology

The invention discloses an electroluminescent display panel and a display device. The electroluminescent display panel comprises a display area and a fingerprint recognition area. The display area comprises display pixel units. Each display pixel unit comprises a first pixel control circuit and a first light emitting unit. The first light emitting unit comprises a first anode. The fingerprint recognition area comprises multiple capacitive fingerprint recognition electrodes which are arranged in arrays and electrode wires which are arranged to be corresponding to and electrically connected withall the capacitive fingerprint recognition electrodes in a one-to-one way. The capacitive fingerprint recognition electrodes and the first anodes have the same material and are arranged on the same layer. The capacitive fingerprint recognition electrodes are arranged and the capacitive fingerprint recognition electrodes are enabled to be arranged in the electroluminescent display panel so that the thickness of the electroluminescent display panel can be reduced and the thinned design can be realized. Besides, the capacitive fingerprint recognition electrodes and the first anodes have the samematerial and are arranged on the same layer so that the manufacturing difficulty of the electroluminescent display panel can be effectively reduced and the manufacturing cost can be saved.

The invention provides a direct type backlight source module. The direct type backlight source module comprises a backboard, a printed circuit board, an LED (light-emitting diode) array with a plurality of LED light sources, a reflecting film, a diffusion board, a diffusion film and a brightness enhancement film, and is characterized in that the diffusion board comprises a light-incident bottom surface which is close to the LED array and a light-emitting top surface which is opposite to the light-incident bottom surface, and conical grooves corresponding to the LED light sources in the LED array are arranged on the light-incident bottom surface of the diffusion board. Compared with the prior art, the direct type backlight source module provided by the invention has the advantages that the vertical distance between the LED light sources and the diffusion board is reduced, the light mixing distance required in the vertical direction is reduced under the situation of ensuring full light mixing, and the thickness of the direct type backlight source module is relatively reduced.

The invention provides a panel spliced type backlight module, which forms a large-size thinned liquid crystal display screen with a liquid crystal module and sequentially comprises a back panel, a reflecting sheet, a light guiding module, light sources, a light mixing space, a diffusion panel and an optical film. More than two supporting positioning columns are arranged between the light guiding module and the diffusion panel, the light guiding module, the supporting positioning columns, the diffusion panel and the optical film are fixed on the back panel, and the optical film is attached on the diffusion panel. The light guiding module is formed by splicing more than two light guiding panels, and the light sources are arranged outside the light guiding panels or between the two light guiding panels. The large-size planar light guiding module is formed by splicing more than two small-size light guiding panels and matching with the light sources inserted laterally, reflecting points distributed by corresponding to spliced line spots of the light guiding panels are arranged on a light inlet surface of the diffusion panel and projections are arranged on a light outlet surface of the diffusion panel, light of the light sources can be mixed so as to realize thinned design of the backlight module.

The invention provides a direct-type backlight module. The direct-type backlight module comprises a light guide plate, the light guide plate comprises a light-in surface which is adjacent to an LED lamp and a light-out surface which is opposite to the light-in surface, a conical groove which corresponds to the LED lamp is formed in the light-in surface of the light guide plate, and an inverted conical groove which corresponds to the conical groove is formed in the light-out surface; through the cooperation effect of the grooves in the two surfaces, even emergence of light rays which are givenout by the LED lamp is achieved. Compared with the prior art, the direct-type backlight module has the advantages that a lens does not need to be arranged on the LED lamp, the light mixing distance isnot needed, and even emergence of the light rays of a light source can be achieved; accordingly, under the situation that sufficient light mixing is guaranteed, the thickness of the direct-type backlight module is reduced in the vertical direction, and the thin-type design of the direct-type backlight module is facilitated.

The invention relates to a direct backlight module which comprises a frame, a plurality of light-emitting diodes arranged at the bottom of the frame, as well as a first optical plate and a second optical plate that are sequentially arranged above the light-emitting diodes at intervals, wherein the first optical plate and the second optical plate respectively comprise a light entry surface and a light exit surface which is opposite to the light entry surface, as well as a plurality of long-strip V-shaped ridge structures which are formed at the light exit surface, extend along at least two different directions and are mutually staggered. The direct backlight module has better exit ray uniformity and is suitable for thinned design.

The invention discloses a mainboard cooling structure for a cellphone, and the cellphone, and relates to the technical field of electronic product cooling. The structure comprises a graphite flake, a mainboard, a chip, and a shielding support fixed on the mainboard. The graphite flake comprises a graphite base body and a double-faced adhesive layer. The chip is disposed on the mainboard, and is located in an internal cavity formed by the mainboard and the shielding support. The graphite flake also comprises an electromagnetic shielding layer, and the electromagnetic shielding layer is disposed between the graphite base body and the double-faced adhesive layer. A side surface of the double-faced adhesive layer is attached to the surfaces of the chip and the shielding support. The invention also discloses the cellphone with the above structure. According to the invention, the graphite flake with a function of electromagnetic shielding is directly pasted on the surfaces of the shielding support and the chip, thereby achieving the thin design of the cellphone mainboard, reducing the thermal resistance between the graphite flake and the chip, improving the cooling effect of the cellphone mainboard, prolonging the service life of the cellphone, and reducing the production cost of the cellphone.

The embodiment of the invention provides a preparation method of a flexible substrate, which comprises the following steps of: providing a hard substrate, and forming a thin film layer on the surfaceof the hard substrate; treating the surface of the thin film layer, so that a hydrophilic region and a hydrophobic region are formed on the surface of the thin film layer, wherein the hydrophilic region or the hydrophobic region comprises a preset black matrix pattern; coating a mixed solution comprising hydrophilic organic polymer and hydrophobic organic polymer on the whole surface of the thin film layer, and forming a flexible substrate layer comprising a transparent region and a black matrix region on the surface of the thin film layer after being subjected to constant temperature treatment and baking treatment; stripping the thin film layer and the hard substrate to obtain the flexible substrate. The preparation method is simple in process, saves the preparation of a prior black matrix, and greatly shortens the process time and the process cost. The invention also provides a flexible substrate, a color film substrate and a display panel.

The embodiment of the invention provides a shell assembly which comprises a first shell, a locking mechanism and a second shell, the first shell comprises a side wall, a first surface and a second surface, the first surface and the second surface are opposite to each other, the locking mechanism comprises a clamping part, a transmission part and a side key, the side key is movably arranged on theside wall, and the side key is in transmission connection with the clamping part through the transmission part; the second shell is rotationally connected to the first shell, so that the first shell and the second shell are selectively and relatively folded or unfolded, and the second shell is provided with a matching part matched with the clamping part; when the first shell and the second shell are oppositely folded, the second surface is attached to the second shell, and the clamping part is driven by the side key to be selectively clamped with or separated from the matching part. The side key is movably arranged on the side wall of the first shell, so that the integrity of the first shell is prevented from being damaged, the thickness of the first shell does not need to be additionallyincreased to meet the telescopic stroke of the side key, the thickness of the whole machine is reduced, and thinning design is achieved. The embodiment of the invention further provides the folding type electronic equipment.

The invention provides a heat conduction device and terminal equipment, which relate to the field of cooling. The heat conduction device comprises a first cover plate and a second cover plate, whereinthe first cover plate and the second cover plate are connected in a sealed mode; the first cover plate is provided with a plurality of grooves, and a supporting part is formed between every two adjacent grooves; a liquid circulation channel and a gas circulation channel are formed in the groove; the liquid circulation channel is filled with a liquid working medium; the liquid circulation channelis communicated with the gas circulation channel; the liquid working medium is evaporated into gas to enter the gas circulation channel, and the gas is condensed into liquid to enter the liquid circulation channel. When the heat conduction device is applied to the terminal equipment, the first cover plate and a heating element of the terminal equipment can be arranged close to each other, so thatcooling of the heating element is realized through gas-liquid circulation of the liquid working medium in the liquid circulation channel and the gas circulation channel.

The invention provides a thinning headphone socket which comprises a body portion and a headset jack. The body portion is provided with a disconnected area and can reduce a space occupying a mobile terminal in thickness. In addition, the invention further provides the mobile terminal using the thinning headphone socket. The thinning headphone socket is small in thickness, and meets the requirements for thinning of the mobile terminal.

The invention discloses a plug connector which is used for being backwards inserted into a socket connector. The connector comprises: an insulating body, wherein the insulating body comprises a main body part and a lock catch arm formed by extending from the top surface of the main body part, the left side and the right side of the front end of the lock catch arm laterally protrude and extend to form lock catch parts respectively to mutual locking and buckling with the buckling part of the socket connector, the locking and buckling part is located in front of the joint of the locking arm and the main body part, the front end of the lock catch arm protrudes upwards between the two locking parts to form a pressing part, and the pressing part is aligned with the locking part in the left-rightdirection; at least one butting terminal which is arranged at the insulating body, wherein each butt joint terminal is provided with a butt joint part used for being connected with at least one conductive terminal of the socket connector in a conductive mode, the locking and buckling part is moved downward for a large distance, so that the locking and buckling part and the corresponding bucklingparts can be separated from each other under the condition that the deformation quantity of the locking and buckling part is very small, and the situation that locking and buckling arm is fatigued andeven broken due to excessive pressing is restrained.

The invention relates to the technical field of cooling sheets, in particular to a metal-plated graphite sheet and a preparation method thereof. The preparation method comprises the following steps of1, plating a graphite sheet with chromium metal through a magnetron sputtering method, 2, plating the chromium support layer of the first graphite sheet with copper alloy on a copper alloy target material through the magnetron sputtering method; and 3, plating the copper alloy shielding layer of the second graphite sheet with nickel metal through the magnetron sputtering method to obtain the metal-plated graphite sheet. The metal-plated graphite sheet and the preparation method have the beneficial effects that in the obtained metal-plated graphite sheet, the heat conduction performance of theplating alloy metal layers is higher than the heat conduction performance of the graphite sheet in the thickness direction, and compared with the condition of no-copper plating or only-copper plating, the heat conduction performance of the graphite cooling sheet in the thickness direction is enhanced, and the electromagnetic shielding performance is also enhanced. The copper alloy shielding layeris doped with the chromium element, so that the strength and the electromagnetic shielding capability of the copper alloy are improved, the copper alloy has good electrical conductivity and thermal conductivity, and the hardness, the crack resistance and the softening temperature of the copper alloy are high.

The invention relates to a normal pressure sealing air insulation ring main unit, which comprises a normal pressure switch sealing box, a pressure release chamber, a cable chamber, a mechanism operation chamber, a three-phase vacuum switch unit and a three-position isolation switch, and is characterized in that the three-position isolation switch is matched with an isolation operation mechanism, and the isolation operation mechanism drives the three-position isolation switch to perform switching action through an isolation main shaft mechanism; the three-phase vacuum switch unit is connected with the elastic operation mechanism through the opening and closing transmission mechanism, the top of a switch support of the three-phase vacuum switch unit is fixedly connected with the transmission mechanism box, a transmission mechanism installation chamber and a side end chamber are arranged in the transmission mechanism box, and the opening and closing transmission mechanism is installed in the transmission mechanism installation chamber. The elastic operation mechanism is installed in the side end chamber and partially corresponds to the position of the mechanism operation chamber, the top of the normal-pressure switch sealing box is provided with a top assembling opening, the three-phase vacuum switch unit is installed in the normal-pressure switch sealing box along the top assembling opening, and the top assembling opening is sealed and covered through the transmission mechanism box. The device has the advantages of reasonable structural layout and compact structure.

The invention provides a shielding piece and electronic equipment. Relates to the technical field of electronic equipment. The shielding member comprises a conductive metal film and an adhesive. Wherein the conductive metal film comprises a base body and conductive protrusions, the base body and the conductive protrusions are of an integrally-formed structure, and the conductive protrusions are arranged on at least one surface of the base body. The adhesive is arranged between every two adjacent conductive protrusions, the shielding part can be bonded to the structural part through the adhesive, and when the adhesive is bonded to the structural part, the conductive protrusions make contact with the structural part to conduct electricity, so that the shielding effect on the structural part is achieved. In addition, the base body and the conductive protrusions of the shielding piece are of an integrally-formed structure, impedance of the shielding piece can be reduced, and therefore the shielding effect of the shielding piece is improved.

The invention provides a light guide plate assembly, a backlight source and a display apparatus. The light guide plate assembly comprises N light guide plate splicing blocks and N-1 total reflection lenses, wherein N is an integer greater than one, and the N light guide plate splicing blocks are successively arranged at intervals along the spreading direction of light; the N-1 total reflection lenses are spliced between gaps of every two adjacent light guide plate splicing blocks in a one-to-one corresponding manner so as to form a large-dimensional light guide plate and spread the light passing by in a lossless manner; and every two adjacent surfaces of the light guide plate splicing blocks and the total reflection lenses are provided with light change structures for damaging a total reflection phenomenon occurring on light-emitting surfaces of the light guide plate splicing blocks. The light guide plate assembly provided by the invention can realize a thin design of a large-dimension backlight source so as to improve the appearance quality of a display apparatus.