Bonding method and bonding structure of surface acoustic wave filter

Abstract

The invention provides a bonding method and a bonding structure of a surface acoustic wave filter. The bonding structure comprises a first bonding metal layer, a second bonding metal layer and a third bonding metal layer; the third bonding metal layer is arranged on the bonding surface of the lower surface of the cover plate of the surface acoustic wave filter; the first bonding metal layer is arranged on the surface of one side, which is not provided with the cover plate, of the third bonding metal layer; the second bonding metal layer is arranged on a bonding surface on which the upper surface of the substrate of the surface acoustic wave filter is bonded with the cover plate; a plurality of groups of bonding grooves are formed in the first bonding metal layer; and the second bonding metal layer is provided with a plurality of groups of bonding protrusions which are the same as the bonding grooves in shape and number and different from the bonding grooves in height and depth.

Description

technical field [0001] The invention provides a bonding method of a surface acoustic filter and a bonding structure thereof, belonging to the technical field of thin film filters. Background technique [0002] The surface acoustic filter is formed by evaporating a layer of metal film on a material substrate with piezoelectric effect, and then forming a pair of interdigitated electrodes at both ends through photolithography. When the signal voltage is applied to the transmitting transducer, an electric field is formed between the input interdigital electrodes to cause mechanical vibration of the piezoelectric material to propagate to the left and right sides in the form of ultrasonic waves, and the energy to the edge side is absorbed by the sound-absorbing material. absorb. At the receiving end, the mechanical vibration is converted into an electrical signal by the receiving transducer and output by the interdigitated electrodes. However, due to the continuous mechanical vi...

AI Technical Summary

Problems solved by technology

[0003] The invention provides a bonding method and bonding structure of a surface acoustic filter, which is used to solve the problem of low bonding stability between the cover plate and the substrate in the wafer sealing structure of the surface acoustic filter, and the wafer of the surface acoustic filter For the problem of poor sealing, the technical solutions adopted are as follows:

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