Connection terminal pattern and layout for three-level buck regulator

A technology of connecting terminals and three levels, which is applied in the direction of adjusting electric variables, electric solid devices, control/regulation systems, etc., and can solve problems such as improving the efficiency of switching regulators

A technology of connecting terminals and three levels, which is applied in the direction of adjusting electric variables, electric solid devices, control/regulation systems, etc., and can solve problems such as improving the efficiency of switching regulators

CN113994581APending Publication Date: 2022-01-28QUALCOMM INC

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  • Connection terminal pattern and layout for three-level buck regulator
  • Connection terminal pattern and layout for three-level buck regulator
  • Connection terminal pattern and layout for three-level buck regulator

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Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0017] Certain aspects of the present disclosure are generally directed to terminal patterns (eg, ball grid array (BGA) patterns) of integrated circuit (IC) packages implementing a three-level buck regulator. Certain aspects also provide for placement of capacitive and inductive elements adjacent to different sides of the IC package as allowed by the terminal patterns described herein.

[0018] Various aspects of the disclosure are described more fully hereinafter with reference to the accompanying drawings. This disclosure may, however, be embodied in many different forms and should not be construed as limited to any specific structure or function presented throughout this disclosure. Rather, these aspects are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art. Based on the teachings herein, those skilled in the art should appreciate that the scope of the present disclosure is intended...

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Abstract

The application generally relates to a connection terminal pattern and layout for a three-level buck regulator. One example electronic module generally includes a substrate, an integrated circuit (IC) package (502) disposed on the substrate and comprising transistors of the three-level buck regulator, a capacitive element (202) of the three-level buck regulator disposed on the substrate, and an inductive element (204) of the three-level buck regulator disposed on the substrate. The capacitive element and the inductive element are disposed adjacent to different sides (530, 532) of the IC package.

Description

[0001] Cross References to Related Applications [0002] This patent application claims priority to U.S. Nonprovisional Application No. 16 / 444,844, filed June 18, 2019, entitled "CONNECTION TERMINAL PATTERN ANDLAYOUT FOR THREE-LEVEL BUCK REGULATOR," which is assigned to the assignee of this application, and expressly incorporated herein by reference. technical field [0003] Certain aspects of the present disclosure relate generally to electronic circuits and, more particularly, to connection terminal patterns and layouts of three-level buck regulators. Background technique [0004] A voltage regulator ideally provides the desired direct current (DC) output voltage regardless of changes in load current or input voltage. Voltage regulators, also known as power converters, can be classified as either linear regulators or switching regulators. While linear regulators tend to be small and compact, many applications could benefit from the increased efficiency of switching regu...

Claims

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Application Information

Patent Timeline
28 Jan 2022
Publication
CN113994581A
IPC
H02M3/156; H01L23/64; H05K1/02
CPC
H02M3/156; H02M7/483; G06F1/3287; H01L23/50; H01L24/01; H01L2924/1306; H01L2924/15311; H01L2924/19042
Inventors
俞成越; 刘振宁