Connection terminal pattern and layout for three-level buck regulator
A technology of connecting terminals and three levels, which is applied in the direction of adjusting electric variables, electric solid devices, control/regulation systems, etc., and can solve problems such as improving the efficiency of switching regulators
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[0017] Certain aspects of the present disclosure are generally directed to terminal patterns (eg, ball grid array (BGA) patterns) of integrated circuit (IC) packages implementing a three-level buck regulator. Certain aspects also provide for placement of capacitive and inductive elements adjacent to different sides of the IC package as allowed by the terminal patterns described herein.
[0018] Various aspects of the disclosure are described more fully hereinafter with reference to the accompanying drawings. This disclosure may, however, be embodied in many different forms and should not be construed as limited to any specific structure or function presented throughout this disclosure. Rather, these aspects are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art. Based on the teachings herein, those skilled in the art should appreciate that the scope of the present disclosure is intended...
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Application Information
- IPC
- H02M3/156; H01L23/64; H05K1/02
- CPC
- H02M3/156; H02M7/483; G06F1/3287; H01L23/50; H01L24/01; H01L2924/1306; H01L2924/15311; H01L2924/19042
- Inventors
- 俞成越; 刘振宁



