Supercharge Your Innovation With Domain-Expert AI Agents!

Chip, IO scheduling method and IO scheduling device

A chip and processor technology, applied in the field of IO scheduling method, chip, computer-readable storage medium and processor, IO scheduling device, can solve the problem of high IO command delay

Pending Publication Date: 2022-02-08
HUNAN GOKE MICROELECTRONICS
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The main purpose of the present application is to provide a chip, an IO scheduling method, an IO scheduling device, a computer-readable storage medium and a processor, so as to solve the problem of high IO command delay of the IO scheduling algorithm in the prior art

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Chip, IO scheduling method and IO scheduling device
  • Chip, IO scheduling method and IO scheduling device
  • Chip, IO scheduling method and IO scheduling device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0020] It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and embodiments.

[0021] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiment of the application will be clearly and completely described below in conjunction with the accompanying drawings in the embodiment of the application. Obviously, the described embodiment is only It is an embodiment of a part of the application, but not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts shall fall within the scope of protection of this application.

[0022] It should be noted that the terms "first" and "second...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a chip, an IO scheduling method and an IO scheduling device. The chip comprises a processor, a first-in-first-out queue and a controller, wherein the processor is used for executing IO commands, the chip comprises the first-in-first-out queue in communication connection with a register and the processor, the first-in-first-out queue is used for storing timeout commands and sending the timeout commands to the processor according to the storage sequence, the timeout command is an IO command of which the time delay exceeds the command timeout time of the IO command, and the command timeout time is set according to priority of the IO command; and the controller is used for monitoring the time delay of the IO command and pushing the IO command to a first-in first-out queue under the condition that the time delay of the IO command is greater than the command timeout time of the IO command, and the processor is used for executing the IO command. The chip solves a problem of high IO command delay of an IO scheduling algorithm in the prior art.

Description

technical field [0001] The present application relates to the field of chip technology, and in particular, to a chip, an IO scheduling method, an IO scheduling device, a computer-readable storage medium, and a processor. Background technique [0002] Existing IO scheduling algorithms are all implemented based on software, and IO scheduling is processed on the device side. Based on the embedded operating system, it is relatively difficult to debug and track. On-chip IO scheduling is caused by unbalanced and unreasonable internal IO processing. IO latency is high. [0003] The above information disclosed in the Background section is only to enhance the understanding of the background of the technology described herein, therefore, the Background may contain certain information which is not formed in the country for those skilled in the art. known prior art. Contents of the invention [0004] The main purpose of the present application is to provide a chip, an IO scheduling ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G06F9/48G06F3/06
CPCG06F9/4843G06F9/4806G06F3/061
Inventor 吕辉
Owner HUNAN GOKE MICROELECTRONICS
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More