Lead frame surface treatment device based on integrated circuit

Abstract

The invention relates to the technical field of lead frame processing, in particular to a lead frame surface treatment device based on an integrated circuit, which comprises a supporting seat, a collecting shell is fixedly mounted at the top of the supporting seat, a conveying mechanism is arranged above the collecting shell, and the conveying mechanism is used for conveying a lead frame. Rectangular plates are symmetrically and fixedly installed on the edge of the top of the collecting shell, the two rectangular plates are located on the two sides of the conveying mechanism correspondingly, the tops of the two rectangular plates are jointly and fixedly connected with a first connecting plate, a driving mechanism is arranged at the bottom of the first connecting plate, and an annular shell is jointly and slidably connected to the upper portion between the two rectangular plates. The surface of the lead frame in the middle of the conveying mechanism is subjected to treatment liquid spraying acidizing treatment, when the water tank moves to a specified position and then returns along with the driving mechanism, water in the water tank is conveniently sprayed out of the round holes, and redundant treatment liquid after surface treatment of the lead frame is timely flushed.

Description

technical field [0001] The invention relates to the field of lead frame processing, in particular to a surface treatment device based on an integrated circuit lead frame. Background technique [0002] As the chip carrier of integrated circuits, the lead frame is a key structural component that realizes the electrical connection between the lead-out end of the chip's internal circuit and the external lead by means of bonding materials to form an electrical circuit. It acts as a bridge connecting the external wire. [0003] The prior art discloses some patent documents on the surface treatment of lead frames. The Chinese patent application number 202020856217.3 discloses a patent for a surface treatment device for semiconductor lead frames, including a processing box, and the two sides of the processing box are respectively installed with Waste liquid recovery tank and water liquid pumping mechanism, acid dilution storage tank is installed on the top surface of the processing ...

AI Technical Summary

Problems solved by technology

[0004] Most of the surface treatment of lead frames is to spray diluted acidic treatment solution on the surface of the lead frame to achieve acidic dissolution of the rough surface of the lead frame, so as to achieve the purpose of polishing and facilitate the subsequent electroplating treatment. The existing lead frame treatment device is in After spraying the treatment liquid, it is inconvenient to clean up the excess treatment liquid on the surface in time, so that too much treatment liquid remains on the surface of the lead frame, which affects the subsequent processing process. For this reason, we propose a surface treatment device based on integrated circuit lead frame

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