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Flexible circuit board for chip on film and chip pakage comprising the same and electronic device comprising the same

A flexible circuit board and chip-on-film technology, which is applied in the direction of circuit heating devices, flexible printed circuit boards, circuits, etc., can solve problems such as chip failure and reduce the reliability of chip packaging, and achieve improved heat dissipation characteristics, reliability and Effect of drive characteristics

Pending Publication Date: 2022-02-18
LG INNOTEK CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Meanwhile, in a chip mounted on a flexible circuit board, heat is generated while driving the chip, and this heat may cause the chip to malfunction and reduce the reliability of the chip package

Method used

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  • Flexible circuit board for chip on film and chip pakage comprising the same and electronic device comprising the same
  • Flexible circuit board for chip on film and chip pakage comprising the same and electronic device comprising the same
  • Flexible circuit board for chip on film and chip pakage comprising the same and electronic device comprising the same

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Embodiment Construction

[0026] Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. However, the spirit and scope of the invention are not limited to a part of the described embodiments, and may be implemented in various other forms, and one or more elements of the embodiments can be selectively combined in various other forms. replace. In addition, the terms (including technical terms and scientific terms, including technical terms and scientific terms) used in the embodiments of the present invention, unless otherwise expressly defined and described, otherwise the same as those of ordinary skill in terms of the present invention, and, for example, in common dictionary The term defined in the term can be construed as having the meaning of the meaning in the context of the related art.

[0027] In addition, the terms used in the embodiments of the present invention are used to describe the embodiments and are not intended to limit the inventi...

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Abstract

A flexible circuit board for a chip on film according to an embodiment includes: a substrate including a first surface and a second surface opposite to the first surface and including a chip mounting region; a circuit pattern layer disposed on the first surface; and a heat dissipation part disposed in the chip mounting region, wherein the substrate is formed with at least two or more holes that are formed in a region overlapping the heat dissipation part, and the heat dissipation part includes: a heat dissipation pattern layer disposed on the first surface; a connection layer disposed inside the hole; and a heat dissipation layer disposed on the second surface.

Description

[0001] Cross-reference related application [0002] The priority of Korean Patent Application No. 10-2020-0097337, filed on August 4, 2020, according to 35U.s.c.119 and 35u.s.c.365, which is incorporated herein by reference. Technical field [0003] EXAMPLES Provides a flexible circuit board for a membrane on a membrane with an improved heat dissipation characteristic and a chip package including the flexible circuit board. Background technique [0004] Recently, various electronic products are thin, miniaturized and lightweight. Therefore, the study of the semiconductor chip is mounted in a high density in a narrow region of the electronic device in various ways. [0005] Among them, since the film (COF) method is used, the COF method can be applied to a flat panel display and a flexible display. That is, since the COF method can be applied to various wearable electronic devices, the COF method is concerned. In addition, since the COF method can achieve fine spacing, as the numbe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/367H01L23/373H05K1/02
CPCH01L23/367H01L23/3735H01L23/3733H05K1/0206H05K1/0201H05K1/0209H05K2201/05H01L23/4985H01L23/3677H01L23/49838H05K1/189H05K2201/09736H05K2201/0338H01L2224/16225H01L2224/17519H01L24/16H01L24/17H05K1/147H01L23/3672
Inventor 姜採元林埈永
Owner LG INNOTEK CO LTD