High-stability MEMS packaging product and manufacturing method thereof

Abstract

The invention provides a high-stability MEMS packaging product and a manufacturing method thereof, the product comprises a substrate, an ASIC chip and a SENSOR chip, the ASIC chip and the SENSOR chip are installed on the substrate, the substrate is provided with a vacuum space, and the vacuum space is located at the lower end of the installation position of the ASIC chip and the SENSOR chip. The manufacturing method comprises the following steps: arranging a vacuum space at the lower ends of the mounting positions of the ASIC chip and the SENSOR chip on the substrate; mounting the ASIC chip at a corresponding position on the substrate; installing the SENSOR chip at a corresponding position on the substrate; and carrying out packaging. According to the invention, the vacuum space is designed in the substrate below the mounting positions of the ASIC chip and the SENSOR chip, although deformation still occurs after packaging processing and baking, the deformation does not affect the performance of the product due to the existence of the vacuum space, that is, the phenomena of sensitivity dispersion, sensitivity drift and the like do not occur when the product is put on the board at a client, the optimization of the MEMS packaging product is realized, and the quality of the MEMS packaging product is improved.

Description

technical field [0001] The invention relates to the technical field of MEMS packaging, in particular to a highly stable MEMS packaging product and a manufacturing method thereof. Background technique [0002] With the digitalization, high-frequency, multi-functionalization, and thin, light, small, and portable development of electronic complete machines, the requirements for corresponding electronic parts and accessories are getting higher and higher, and the volume is correspondingly smaller and smaller. In this context, as one of the important parts of the above-mentioned portable electronic products, many new products have been launched in the field of microphone products, among which MEMS silicon microphones are one of them. In particular, for acoustic devices such as MEMS silicon microphones, higher performance requirements need to be achieved. [0003] MEMS chip design needs to consider packaging. Packaging is an important part of MEMS devices to form products. Only w...

AI Technical Summary

Problems solved by technology

[0004] MEMS silicon microphones are often packaged and tested after the finished product produced by the manufacturing end. The traditional MEMS silicon microphone product packaging uses a solid substrate (Substrate), which will be slightly deformed after packaging processing and baking. The board is prone to the phenomenon of sensitivity dispersion and sensitivity drift, etc., and the present invention solves this problem through technical improvement

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