A silicon wafer rewinding machine device and operating method
An operation method and technology of rewinding machine, which are applied in the directions of conveyor objects, transportation and packaging, electrical components, etc., can solve the problems of low rewinding efficiency and affect the output of silicon wafer rewinding, so as to improve the quality of chamfering and the rewinding. Sheet efficiency, the effect of easy chamfering work
Active Publication Date: 2022-05-06
杭州中欣晶圆半导体股份有限公司
View PDF7 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0005] The technical problem solved by the present invention is: manual rewinding easily leads to low rewinding efficiency, which seriously affects the output of silicon wafer rewinding
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment
[0030] see Figure 1-Figure 6 As shown, a silicon wafer rewinding machine device includes a body 1, a workbench 100 is arranged on the top of the body 1, and a frame 110 in an L-shaped structure is installed on the top surface of the workbench 100, and the top of the frame 110 is installed with Lifting cylinder 120, and the bottom of frame 110 is provided with chamfering mechanism 3, and the below of chamfering mechanism 3 is provided with chamfering platform 4, and one side of chamfering platform 4 is provided with transfer mechanism 2, is used for placing the The silicon wafer 220 is transferred to the chamfering station 4 to realize the exchange of the silicon wafer 220 cassette container and facilitate the reversing of the silicon wafer 220.
[0031] The transfer mechanism 2 includes a rodless cylinder 230 fixedly arranged on the top of the workbench 100, the surface of the rodless cylinder 230 is covered with a transmission seat 240, the top of the transmission seat 240 i...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention discloses a silicon wafer rewinding machine device and an operation method, and specifically relates to the technical field of silicon wafer rewinding equipment. The invention uses a suction cup to suck the silicon wafers in the placement seat, and slides the silicon wafers on the top plate frame through a rodless cylinder. Moving on the guide rail, the push cylinder pushes the suction cup cylinder to transfer the silicon wafer to the upper position of the chamfering table, and moves the silicon wafer down to the chamfering table through the downward movement of the suction cup cylinder to realize the transfer of the silicon wafer, which is completed automatically The silicon wafer rewinding process improves the silicon wafer rewinding efficiency. The vacuum chuck tightly sucks the transferred silicon wafers. Grinding and chamfering the other surface of the silicon wafer improves the chamfering quality of the silicon wafer. The protective cover is placed outside the chamfering seat to seal the chamfering seat to ensure the sealing during chamfering and avoid the dust generated by chamfering. The leak drifts away.
Description
technical field [0001] The invention relates to the technical field of silicon wafer rewinding equipment, in particular to a silicon wafer rewinding machine device and an operation method. Background technique [0002] Silicon wafers are a very important material basis in electronic information technology. With the continuous development of society, people's demand for silicon wafers is gradually increasing, and the requirements for the shape of silicon wafers are also more diverse. In order to carry out different processes on silicon wafers For processing, it is necessary to exchange silicon wafers processed by different processes between different cassette containers, and this process can be called a rewinding process. [0003] When rewinding silicon wafers, the method of manual rewinding is usually adopted. However, due to the high labor cost and the tendency to cause fragmentation, the manual method affects the rewinding efficiency, and the degree of automation is low, w...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/683H01L21/687H01L21/677H01L21/304
CPCH01L21/6838H01L21/68742H01L21/67766H01L21/304
Inventor 李媛
Owner 杭州中欣晶圆半导体股份有限公司