Packaging module and electronic equipment

A technology for packaging modules and functional modules, applied in the field of circuits, can solve the problems of increasing the volume of electronic equipment and increasing the power distribution loss of electronic equipment, and achieve the effect of reducing size and reducing power distribution loss.

Pending Publication Date: 2022-03-01
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Long wiring will increase the volume of electronic equipment and increase the power distribution loss of electronic equipment

Method used

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  • Packaging module and electronic equipment
  • Packaging module and electronic equipment
  • Packaging module and electronic equipment

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Embodiment Construction

[0044] In order to make the purpose, technical solutions and advantages of the present application clearer, the embodiments of the present application will be described below in conjunction with the accompanying drawings. Apparently, the described embodiments are only part of the present application, rather than all of them. . Those skilled in the art know that, with the emergence of new application scenarios, the technical solutions provided in the embodiments of the present application are also applicable to similar technical problems.

[0045] The terms "first", "second" and the like in the description and claims of the present application and the above drawings are used to distinguish similar objects, and not necessarily used to describe a specific sequence or sequence. It is to be understood that the terms so used are interchangeable under appropriate circumstances such that the embodiments described herein can be practiced in sequences other than those illustrated or des...

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Abstract

The embodiment of the invention discloses a packaging module and electronic equipment, a first surface and a second surface of a PCB (Printed Circuit Board) in the packaging module are respectively covered with a plastic packaging layer, a conductive pin is electrically connected with the PCB, the conductive pin is arranged in the plastic packaging layer in a penetrating manner along the stacking direction of the PCB and the plastic packaging layer, and a part of the conductive pin is exposed out of the outer surface of the plastic packaging layer. When the packaging module is electrically interacted with other elements, the PCB outputs or inputs electricity through the conductive pins. Therefore, there is no need to reserve a through hole in the packaging side edge of the packaging module, the packaging module can be arranged at a position closer to the chip, and the wiring between the packaging module and the chip is short. Furthermore, the size of the electronic equipment is reduced, and the power distribution loss of the electronic equipment is reduced.

Description

technical field [0001] The present application relates to the technical field of circuits, in particular to a packaging module and electronic equipment. Background technique [0002] In order to meet the growing demand for high-performance applications such as artificial intelligence and big data mining, the operating current of the main power chip of electronic equipment continues to increase. Currently, the demand for power in some electronic devices reaches hundreds of amperes. Therefore, it is particularly important to reduce power loss in electronic equipment. [0003] In some devices, in an existing packaging module, a printed circuit board (Printed Circuit Board, PCB) is usually packaged using a molding technology. The packaged module after packaging needs to reserve a through hole on the side of the package, so that the pin needle can be connected to the PCB in the packaged module after being inserted into the through hole. In this way, the packaging module can ou...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/18H05K3/32
CPCH05K1/18H05K1/185H05K3/32H05K3/284H01L23/3121H05K1/181H05K2201/10318H05K3/28H05K2201/10242
Inventor 吕亚涛唐庆国王宁
Owner HUAWEI TECH CO LTD
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