33results about How to "Short trace" patented technology

The invention relates to a receiving module that can be used for a laser radar. The receiving module comprises a PCB substrate which is provided with a first side and a second side; a photoelectric sensor array including a plurality of photoelectric sensors and arranged on the first side of the PCB substrate; and a readout chip disposed on the second side of the PCB substrate, coupled to the photoelectric sensor array, and configured to receive and read output of the photoelectric sensors in the photoelectric sensor array.

The invention discloses a grid driving circuit. In a display stage, in response to a low potential of a second voltage end, first and second control modules disconnect a third voltage end from a first output end; in a touch control stage, in response to a high potential of the second voltage end, the first and second control modules connect the third voltage end with the first output end; and thus, each scanning unit is provided with the first and second control modules, in the touch control stage, the first control module keeps the first output end in the low potential and the second control module keeps a second output end in the low potential, so that a capacitive coupling effect between grid lines and touch control electrodes in a touch control display panel used by the grid driving circuit is weakened, the precision of touch control detection is improved, added lines are short and narrow, an occupied frame is small in the area, and a narrow frame can be realized.

The application discloses a laser radar. The laser radar in the present application comprises a main shaft, a radar rotor, a base, a first mainboard, a second mainboard, an angle measuring assembly, apower supply assembly and a communication assembly. The first mainboard is fixedly arranged relative to the radar rotor and is arranged around a main shaft, and the second mainboard is fixedly arranged relative to the base and is closer to the base than the first mainboard; the angle measuring assembly, the power supply assembly and the communication assembly are disposed between the first mainboard and the second mainboard, and at least a portion of the angle measuring assembly, at least a portion of the power supply assembly, and at least a portion of the communication assembly are disposedaround the main shaft; a first measuring module, a first power supply module and a first communication module are fixedly arranged relative to the radar rotor, and a second measuring module, a secondpower supply module and a second communication module are fixedly arranged relative to the radar stator. The laser radar can shorten the traces of each module, facilitate installation and maintenance, and improve the mechanical reliability of the laser radar.

According to the embodiment, the invention discloses a gate drive circuit. In the gate drive circuit, first control modules respond to signals of first signal en and second signal ends, and in a touch control stage, third voltage ends and first output ends are conducted by virtue of the first control modules; second control modules respond to the signals of the first signal ends and the second signal ends, and in the touch control stage, the third voltage ends and the second output ends are conducted by virtue of the second control modules; therefore, by arranging the first and the second control modules in various canning units, in the touch control stage, the first output ends are controlled at a low potential by virtue of the first control modules, and meanwhile, the second output ends are controlled at a low potential by virtue of the second control modules, so that a capacity coupling action between various gate lines and a touch control electrode in a touch control display panel applied to the gate drive circuit is weakened, and touch control detection precision is enhanced; and an added cable is relatively short, relatively narrow and relatively small in occupied bezel area; therefore, the gate drive circuit is conducive to implementation of a narrow bezel.

The invention discloses an optical module and solves the problem of PCB wiring difficulty in the prior art. The optical module comprises a circuit board, a lens assembly and a fiber adapter corresponding to the lens assembly, wherein the driving chip of the lens assembly communicates with electric signal interfaces on a specific position area on the circuit board to reduce intersects of communicating channels between the electric signal interfaces on the specific position area and the driving chip. The electric signal interfaces on the specific position area are determined according to the types of the optical assemblies driven by the driving chip, and types and arrangement of each electric signal interface on the circuit board. A jumper wire device of the lens assembly communicates with the fiber adapter through an optical fiber ribbon. The sequence of the optical fiber ribbon accessing to the channels on the jumper wire device side is different from the sequence of the optical fiber ribbon accessing to the channels on the fiber adapter side. The optical module accesses the electric signal interfaces on the specific position area to the driving chip, which reduces or eliminates intersects of PCB wirings.

The embodiment of the invention discloses a packaging module and electronic equipment, a first surface and a second surface of a PCB (Printed Circuit Board) in the packaging module are respectively covered with a plastic packaging layer, a conductive pin is electrically connected with the PCB, the conductive pin is arranged in the plastic packaging layer in a penetrating manner along the stacking direction of the PCB and the plastic packaging layer, and a part of the conductive pin is exposed out of the outer surface of the plastic packaging layer. When the packaging module is electrically interacted with other elements, the PCB outputs or inputs electricity through the conductive pins. Therefore, there is no need to reserve a through hole in the packaging side edge of the packaging module, the packaging module can be arranged at a position closer to the chip, and the wiring between the packaging module and the chip is short. Furthermore, the size of the electronic equipment is reduced, and the power distribution loss of the electronic equipment is reduced.

The invention discloses a region division method and device for a photovoltaic power station, and the method comprises the steps: carrying out the region division of the photovoltaic power station based on the arrangement information of the photovoltaic power station, obtaining a plurality of preliminary divided regions, and based on the adjacent relation between the preliminary divided regions and a first preset region capacity, carrying out capacity matching on the plurality of preliminary division areas to obtain a plurality of first optimization areas, and processing the plurality of first optimization areas to obtain a plurality of second optimization areas based on the adjacent relation among the first optimization areas, the adjacent relation of the photovoltaic string and the adjacent relation of the block, and when the capacities of all the second optimization areas reach the second preset area capacity, determining the second optimization areas as target optimization areas. According to the method, the regions are divided based on the arrangement information of the photovoltaic power stations, so that the photovoltaic group strings in the regions are adjacent, the capacity of each region is controllable by carrying out capacity matching on the regions, in addition, the aggregation degree of each region is the highest while the adjacent group strings in the regions are ensured, and the region division efficiency can be improved.

The invention discloses a control system for a lifting LED display screen. The control system comprises multiple display units arranged on guide rails, receiving cards arranged on the display units, sending cards arranged on a control chamber of the LED display screen, and a video player. Each display unit comprises multiple LED light bars and a truss and further comprises distance sensors, a speed sensor and proximity switches. The sending cards are used for receiving video information sent by the video player and converting the video information into a mode recognized by the receiving cards. The receiving cards are used for sending the video information to the LED light bars so as to be displayed. The sending cards can control the LED display screen according to information of the speed sensors, the distance sensors and the proximity switches, the LED display screen can be kept in a non-working state in the ascending and descending processes, a lifting system and a display system cannot work at the same time, and flexibility and safety of the lifting LED display screen are improved.

The invention discloses a built-in type switch cabinet. The built-in type switch cabinet comprises a cabinet body and a circuit breaker. The cabinet body is provided with a front cabinet plate; the cabinet body is internally provided with a three-phase static contact unit; the static contact unit comprises an upper static contact and a lower static contact; the upper static contact is electrically connected with a main busbar; the lower static contact is electrically connected with a branch busbar; the circuit breaker is provided with a three-phase moving contact unit; the moving contact unit comprises an upper moving contact and a lower moving contact; the three-phase static contact unit is arranged in tandem; the three-phase moving contact unit is arranged in tandem; the circuit breaker can be pushed into the cabinet body from the front of the cabinet and can move to the left and right between a test position and a work position; each phase of moving contact unit and each phase of static contact unit of the circuit breaker at the work position are contacted and electrically connected; and the front cabinet plate is provided with an observation window. The advantages are as follows: user operation is carried out in front of the cabinet, contact states can be observed through the observation window during operation, good isolation or contact is ensured, safety hidden risks are avoided, the performance is improved, the cost is reduced, and the reliability and safety are improved.

The invention provides a semiconductor structure and a chip packaging method. The semiconductor structure comprises a substrate, a first chip and a second chip, wherein the first chip and the second chip are arranged on the substrate in parallel; wherein the first chip and the second chip are interconnected directly through a lead bonding process; moreover, for the pins, where high-speed signals need to pass, between the first chip and the second chip, the pins are configured to be oppositely arranged and are connected through parallel routing. According to the embodiment of the invention, through a lead bonding technology between chips, the circuit is shorter in routing, small in occupied space, better in performance of high-speed signals, free of too much change in cost, and even lower in cost. Compared with 2.5 D and 3D packaging, the cost of the embodiment is much lower, the requirement for manufacturing equipment is not high, and the method is very suitable for large-scale production.

The invention provides a semiconductor packaging structure, which comprises a first interconnection structure layer, a first chip layer and a second chip layer, wherein the first chip layer is located on the surface of one side of the first interconnection structure layer, the first chip layer comprises a plurality of first chips, and the front surfaces of the first chips in the first chip layer face the first interconnection structure layer and are electrically connected with the first interconnection structure layer; the second chip layer is located on the surface of the side, back to the first chip layer, of the first interconnection structure layer, the second chip layer comprises a plurality of second chips, and the front surfaces of the second chips in the second chip layer face the first interconnection structure layer and are electrically connected with the first interconnection structure layer; and the front faces of the second chips in the first chip layer and the second chip layer face the first interconnection structure layer, and opposite welding is achieved through the first interconnection structure layer. The opposite surfaces of the chips needing to be butted are directly welded, line transmission loss can be effectively reduced, compared with solder ball welding, the thickness of the first interconnection structure layer between the chips is relatively thin, and the overall thickness of the packaging structure can be effectively reduced.