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Laser drilling method and processing equipment

A technology of laser drilling and processing equipment, applied in laser welding equipment, metal processing equipment, welding equipment, etc., can solve the problems of poor processing quality and low processing efficiency

Pending Publication Date: 2022-03-01
HANS CNC SCI & TECH
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  • Application Information

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Problems solved by technology

[0005] In view of this, the application provides a laser drilling method and processing equipment to solve the problems of low processing efficiency and poor processing quality of laser drilling solutions in the prior art

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  • Laser drilling method and processing equipment
  • Laser drilling method and processing equipment
  • Laser drilling method and processing equipment

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Embodiment Construction

[0038] In order to better understand the technical solutions of the present application, the embodiments of the present application will be described in detail below in conjunction with the accompanying drawings.

[0039] It should be clear that the described embodiments are only some of the embodiments of the present application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of this application.

[0040] Terms used in the embodiments of the present application are only for the purpose of describing specific embodiments, and are not intended to limit the present application. The singular forms "a", "said" and "the" used in the embodiments of this application and the appended claims are also intended to include plural forms unless the context clearly indicates otherwise.

[0041] It should be understood that the term "and / ...

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Abstract

The invention provides a laser drilling method and machining equipment, the laser drilling method is used for conducting drilling operation on a to-be-machined plate, and the to-be-machined plate comprises a first material layer and a second material layer which are arranged in a stacked mode. The laser drilling method includes burning through the second material layer with a second laser. The first material layer is burned through with a first laser. Wherein the absorptivity of the second material layer to the second laser is higher than the absorptivity of the second material layer to the first laser. By means of the characteristic that the second material layer is low in absorptivity to the first laser, when the first laser is used for machining the first material layer, damage to the second material layer can be reduced, the hole machining quality is guaranteed, the machining efficiency of different materials on the to-be-machined plate can be improved, and then the total machining efficiency is improved. The invention further provides machining equipment, and the laser drilling method is applied to the machining equipment. By adopting the laser drilling method and the machining equipment in the scheme, the quality and efficiency of laser drilling can be improved.

Description

【Technical field】 [0001] The invention relates to the technical field of laser drilling, in particular to a laser drilling method and processing equipment. 【Background technique】 [0002] With the rapid development of the electronics industry, the requirements for the circuit board manufacturing industry are getting higher and higher, the number of layers of the circuit board itself is also increasing, the hole density is increasing and the diameter is decreasing. [0003] Generally speaking, the circuit board body includes many different materials, such as resin, rubber and copper. Because there are circuit wires on both sides of the circuit board, there must be a proper electrical connection between the two sides. The "bridge" between the circuits is called a via. The production capacity and quality of mechanical drilling machines in the prior art to process tiny through holes cannot meet the needs of products, while the high energy and collimation properties of laser dri...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00B23K26/70B23K26/382
CPCH05K3/0038B23K26/382B23K26/702H05K2203/107
Inventor 陈长平杨朝辉
Owner HANS CNC SCI & TECH
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