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Full-automatic 3D solder paste precision detection equipment

A testing equipment and fully automatic technology, which is applied to measuring devices, instruments, and optical devices, etc., can solve the problems of not having the horizontal movement of the camera, not having the function of adjusting the angle of the camera, and being unable to meet the solder paste inspection work, etc., to improve the practicality performance, improve detection quality, and stabilize camera movement

Pending Publication Date: 2022-03-04
深圳元道兴智能科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Chinese patent application No. CN210051297U discloses a solder paste thickness detection device. The original device does not have the function of moving the camera horizontally. The camera can only detect one point of solder paste, which cannot meet the detection work of multiple points of solder paste. The device does not have the function of adjusting the angle of the camera, so it cannot meet the shooting and detection work from different angles

Method used

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  • Full-automatic 3D solder paste precision detection equipment
  • Full-automatic 3D solder paste precision detection equipment
  • Full-automatic 3D solder paste precision detection equipment

Examples

Experimental program
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Effect test

Embodiment 1

[0024] see Figure 1-4 , the present invention provides the following technical solutions: a fully automatic 3D solder paste precision testing equipment, including a workbench 2, a frame body 1 is arranged on the upper end of the workbench 2, and a clamping device 3 is arranged on the lower side of both ends inside the frame body 1 , the upper side of the workbench 2 is provided with a camera 5, one end of the camera 5 is provided with a laser head 4, the upper side of the camera 5 is provided with a moving plate 10, and a plurality of fixed rods 11 are arranged through the moving plate 10, and the rear end of the frame body 1 The position corresponding to the upper side and the mobile plate 10 is provided with a right-angle plate 6 , the upper end of the right-angle plate 6 is provided with a motor 7 , the output end of the motor 7 is provided with a gear 8 , and the upper end of the mobile plate 10 is provided with a rack 9 corresponding to the gear 8 .

[0025] Specifically...

Embodiment 2

[0033] The difference between this embodiment and Embodiment 1 is: the upper end of the camera 5 is provided with a connecting plate 13, and one side between the connecting plate 13 and the moving plate 10 is provided with an electric push rod-12, and between the connecting plate 13 and the moving plate 10 The other side is provided with electric push rod two 14.

[0034] By adopting the above technical solution, when the first electric push rod 12 and the second electric push rod 14 are retracted synchronously, the camera 5 and the laser head 4 can be driven to adjust the height.

[0035] Specifically, a fixed cover 16 is arranged at the middle position of the lower end of the movable plate 10 , a sliding plate 15 is arranged in the fixed cover 16 , and a sliding bar 17 is arranged at the lower end of the sliding plate 15 .

[0036] By adopting the above technical solution, by setting the slide bar 17 and the fixed cover 16, the adjustment of the height and angle of the camer...

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Abstract

The invention discloses full-automatic 3D solder paste precision detection equipment, and belongs to the technical field of solder paste detection equipment.The full-automatic 3D solder paste precision detection equipment comprises a workbench, a frame is arranged at the upper end of the workbench, clamping devices are arranged on the lower sides of the two ends in the frame, a camera is arranged on the upper side of the workbench, and a laser head is arranged at one end of the camera; a camera is arranged on the upper side of the frame body, a moving plate is arranged on the upper side of the camera, a plurality of fixing rods are arranged in the moving plate in a penetrating mode, a right-angle plate is arranged at the position, corresponding to the moving plate, of the upper side of the rear end of the frame body, a motor is arranged at the upper end of the right-angle plate, and a gear is arranged at the output end of the motor. The gear drives the movable plate to slide on the fixed rod through the rack, and meanwhile, the movable plate can drive the laser head and the camera on the lower side to horizontally move, so that the requirement for multi-point detection of the solder paste is met, and the detection quality is improved.

Description

technical field [0001] The invention belongs to the technical field of solder paste detection equipment, and in particular relates to a fully automatic 3D solder paste precision detection equipment. Background technique [0002] Solder paste is also called solder paste, gray paste. Solder paste is a new type of soldering material that emerged with SMT. It is a paste mixture formed by mixing solder powder, flux, and other surfactants and thixotropic agents. It is mainly used for soldering electronic components such as PCB surface resistance, capacitor and IC in SMT industry. [0003] Chinese patent application No. CN210051297U discloses a solder paste thickness detection device. The original device does not have the function of moving the camera horizontally. The camera can only detect one point of solder paste, which cannot meet the detection work of multiple points of solder paste. The device does not have the function of adjusting the angle of the camera, so it cannot me...

Claims

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Application Information

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IPC IPC(8): G01B11/06
CPCG01B11/06
Inventor 白秋林吕艳秋白翔
Owner 深圳元道兴智能科技有限公司