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Chip device and preparation method thereof

A device and chip technology, applied in the field of chip devices and their preparation, can solve the problems of increasing the production cost of chip devices, reducing the reliability of chip devices, increasing the difficulty of processing heat dissipation covers, etc., reducing the steps of processing technology, reducing processing difficulty, The effect of increasing the success rate

Pending Publication Date: 2022-03-04
HYGON INFORMATION TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the existing process of packaging the chip, in order to avoid the problem that the reliability of the chip device is reduced due to deformation of the substrate or uneven stress distribution on the substrate, a support frame is usually provided in the cavity of the heat dissipation cover to dissipate heat during installation. The support frame reinforces the substrate when covering
However, using this method requires the support frame to have the same flatness as the body of the heat dissipation cover, which will increase the processing difficulty of the heat dissipation cover, which in turn will increase the production cost of the chip device

Method used

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  • Chip device and preparation method thereof
  • Chip device and preparation method thereof
  • Chip device and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0034] This embodiment provides a chip device, combined with figure 1 , figure 2 with Figure 5 , the chip device includes: a heat dissipation cover 1 , a passive device 2 , a substrate 3 , a bare chip 4 and a supporting member 5 .

[0035] Among them, the passive device 2 is also called a passive device, which has the characteristics of not consuming electric energy itself, or converting electric energy into other energy in different forms, and at the same time only needs to input a signal, and can work normally without an external power supply. In this embodiment, the passive device 2 includes: one or more of resistors, capacitors, inductors, converters, gradienters, matching networks, resonators, filters, mixers and switches.

[0036] The heat dissipation cover 1 , the passive device 2 , the bare chip 4 and the support member 5 are all disposed on the upper surface of the substrate 3 . Solder balls are fixed on the lower surface of the substrate 3 for the installation o...

Embodiment 2

[0043] This embodiment provides a method for preparing a chip device as in Embodiment 1, combining image 3 , Figure 4 , Figure 5 with Image 6 , the method includes steps S101 to S108:

[0044] Step S101 : providing a substrate 3 .

[0045] Step S102 : attaching the passive device 2 on the substrate 3 .

[0046] Step S103 : bonding the support member 5 on the substrate 3 .

[0047] Step S104 : soldering the bare chip 4 on the substrate 3 by reflow soldering.

[0048] Step S105 : Paste the heat conduction layer 6 on the top of the bare chip 4 .

[0049] Step S106 : filling the bottom of the bare chip 4 with glue. The adhesive is a chip encapsulation adhesive.

[0050] Step S107 : installing the heat dissipation cover 1 so that the heat dissipation cover 1 covers the outside of the bare chip 4 and the support member 5 .

[0051] Step S108 : planting balls on the bottom of the substrate 3 .

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Abstract

The invention provides a chip device and a preparation method thereof, and the method comprises the steps: providing a substrate; mounting a supporting piece and a bare chip on the substrate; and installing a heat dissipation cover so that the heat dissipation cover covers the outer sides of the bare chip and the supporting piece. According to the invention, the production cost of the chip device can be reduced.

Description

technical field [0001] The invention relates to the technical field of chip packaging, in particular to a chip device and a preparation method thereof. Background technique [0002] With the rapid development of science and technology, the technology of chip packaging has been greatly improved. [0003] In the existing process of packaging the chip, in order to avoid the problem that the reliability of the chip device is reduced due to deformation of the substrate or uneven stress distribution on the substrate, a support frame is usually provided in the cavity of the heat dissipation cover to dissipate heat during installation. The support frame reinforces the substrate when covering. However, this method requires that the support frame has the same flatness as the body of the heat dissipation cover, which will increase the processing difficulty of the heat dissipation cover, and further increase the production cost of the chip device. Contents of the invention [0004] ...

Claims

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Application Information

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IPC IPC(8): H01L21/50H01L21/52H01L25/16H01L23/13H01L23/04
CPCH01L21/50H01L21/52H01L25/16H01L23/13H01L23/04
Inventor 陆洋
Owner HYGON INFORMATION TECH CO LTD