Integrated circuit assembly positioning device

Abstract

The invention discloses an integrated circuit assembly positioning device which comprises a base, a positioning groove matched with a pin is formed in the base, a pin limiting piece connected with a first air cylinder is arranged on one side of the positioning groove in the length direction, and a first guide groove and a second guide groove are formed in the other side of the positioning groove in the length direction. The first guide groove is communicated with the positioning groove and is perpendicular to the length direction; the second guide groove is communicated with the positioning groove and the accommodating groove and is parallel to the length direction of the positioning groove; third guide grooves communicating with the positioning groove and the containing groove are formed in the two sides of the positioning groove in the width direction, clamping blocks are arranged in the third guide grooves, and the clamping blocks are connected with the synchronous operation device. A positioning block is arranged in the first guide groove in a sliding fit mode and connected with a second air cylinder, a moving block and an elastic clamp which are connected with a third air cylinder are arranged in the second guide groove, the elastic clamp is movably located between the moving block and the pin limiting piece, and the side face, close to the moving block, of the positioning block is an inclined face. According to the invention, the purpose of accurately positioning integrated circuits in batches is achieved, and the assembly positioning precision and efficiency are improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor device packaging, in particular to an integrated circuit assembly positioning device. Background technique [0002] With the rapid development of modern microelectronics technology, more and more industries require more and more high-reliability packages. The existing high-reliability packages are generally ceramic packages, metal packages, glass packages, etc. These types of high-reliability packages have some things in common, mainly including: the package body is independent, the package dimensions are deviated, the batch size is small, and there are many types, etc., which makes all the processes of this type of circuit processing general They are all processed individually, and batch automatic feeding cannot be adopted. Most of the processing process is manual, which leads to deviations in dimensional consistency after circuit packaging. With the development of integrated circuit appli...

AI Technical Summary

Problems solved by technology

At present, the manual direct naked eye alignment, the accuracy can not be guaranteed

[0005] In order to improve the processing quality of this type of packaging, it is necessary to design suitable tooling and fixtures based on factors such as technology, quality, and cost. On the one hand, it can solve the problem of product processing quality consistency; on the other hand, it can solve the problem of high labor intensity for operators.

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