Freezing box of new semiconductor refrigeration and heat radiation structure

Abstract

A freezing box with a new type of semi-conductor refrigerating and heat radiation structure is to install the semi-conductor refrigerating assembly on the box wall, the cooling end of the box body erected with refrigeration conducting device and the hot end of the box body erected with heating vadiation conducting device, the said heat radiation device including an evaporating block of the evaporation chamber, the evaporation block to be connected with multi bundle conducing tubes arranged in plane lines as a heat radiation conducting plate, a circle circulating tube to be erected on the outer wall of the said evaporation chamber, each conducting tube and the media with in the tube to be connected to the evaporating chamber.

Description

technical field [0001] The invention relates to refrigeration equipment, in particular to a refrigerator adopting a novel semiconductor refrigeration and heat dissipation structure. Background technique [0002] Semiconductor refrigeration technology is based on the Peltier effect, using the potential energy changes and heat absorption and heat release phenomena generated by the electrons and holes in the two conductors in the energized circuit to form cold and hot ends, and then realize refrigeration. (thermal) performance. At present, the semiconductor refrigeration technology is widely used in many aspects, but in the actual application of refrigerator products, often due to the poor matching of cooling and heat dissipation structures and the influence of the cooling depth of the semiconductor refrigeration components themselves, the refrigerator is in the process of causing damage. The effect of cooling performance is greatly limited. Since the optimization of semicondu...

AI Technical Summary

Problems solved by technology

At present, the semiconductor refrigeration technology is widely used in many aspects, but in the actual application of refrigerator products, often due to the poor matching of cooling and heat dissipation structures and the influence of the cooling depth of the semiconductor refrigeration components themselves, the refrigerator is in the process of causing damage. The effect of cooling performance is greatly limited. Since the optimization of semiconductor materials is still in the stage of exploration and experimentation, it is even more necessary to provide a more scientific and reasonable cooling and heat dissipation structure. While achieving multiple features such as silence and pollution-free, it can achieve deep cooling to a greater extent

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