Server and heat dissipation dustproof case thereof

A dust collector and dust cover technology, applied in the server field, can solve the problems of dustproof and waterproof in the heat dissipation holes of the chassis, and achieve the effect of improving the service life and running performance, solving dustproof and waterproof, and being convenient to operate.

Pending Publication Date: 2022-03-11
INSPUR (SHANDONG) COMPUTER TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a heat-dissipating and dust-proof chassis, which can solve the problem of dust-proof and waterproof in the cooling holes of the chassis, and can ensure the cooling efficiency of the chassis, thereby improving the service life and operating performance of the server

Method used

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  • Server and heat dissipation dustproof case thereof
  • Server and heat dissipation dustproof case thereof
  • Server and heat dissipation dustproof case thereof

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Embodiment Construction

[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0025] The core of the present invention is to provide a heat-dissipating and dust-proof chassis, which can solve the problem of dust-proof and waterproof cooling holes of the chassis, and can ensure the cooling efficiency of the chassis, thereby improving the service life and operating performance of the server. Another core of the present invention is to provide a server including the above heat dissipation and dustproof chassis.

[0026] In order to enable ...

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Abstract

The invention discloses a server and a heat dissipation dustproof case thereof, the heat dissipation dustproof case comprises a plate body and heat dissipation holes formed in the plate body, the plate body is provided with a rotating shaft, the rotating shaft is provided with a dustproof cover hinge capable of being unfolded and rolled, and the heat dissipation dustproof case further comprises a rotation control part which is connected with the rotating shaft and controls the rotating shaft to rotate. The traction assembly is connected with the dust cover hinge and is used for pulling the dust cover hinge; and by adjusting the traction assembly, part of the dust cover hinge is rolled on the rotating shaft under the control of the rotating control piece, so that the heat dissipation holes are opened. The heat dissipation dustproof case can solve the dustproof and waterproof problems of the heat dissipation holes of the case, and can ensure the heat dissipation efficiency of the case, so that the service life of a server can be prolonged, and the operation performance of the server can be improved; meanwhile, the case is simple in structure, and the dustproof cover hinge is convenient and fast to open and close.

Description

technical field [0001] The invention relates to the technical field of servers, in particular to a heat dissipation and dustproof chassis. The invention also relates to a server with the heat dissipation and dustproof cabinet. Background technique [0002] With the development of electronic technology, computer products have become the main tool for people's daily office and life. [0003] At present, computers are composed of various hardware modules, such as motherboards, storage, computing modules, fans, power supplies, and so on. Since various modules are integrated and installed in the chassis, a lot of heat will be generated during operation. The number of heat dissipation holes in the design is also increasing, which will cause dust and water stains to enter the chassis through the heat dissipation holes in actual use, and the accumulation of dust will significantly affect the heat dissipation efficiency and operating performance of electronic components. Water dam...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/18G06F1/20B08B17/02
CPCG06F1/183G06F1/20B08B17/02
Inventor 贾政李文方刘耀阳马志强
Owner INSPUR (SHANDONG) COMPUTER TECH CO LTD
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