Array substrate and manufacturing method thereof
A technology for array substrates and manufacturing methods, which is applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve problems such as easy peeling of film layers, low production yield, and decreased product reliability, so as to improve peeling phenomena and improve production. Yield rate, effect of increasing adhesion
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[0034] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Apparently, the described embodiments are only some of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making creative efforts belong to the protection scope of this application.
[0035] For the existing array substrates, due to the large size, complex film layers and numerous manufacturing processes, the film layer is prone to fall off from the substrate or the upper film layer and the lower film layer are peeled off during the production process, resulting in low production yield. The present invention securely locks the film layer and the substrate or different film layers together by means of a micromechanical lock structure, so as to improve the peeling ...
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