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Circuit board, manufacturing method thereof and electronic equipment

A production method and circuit board technology, which are applied in the manufacture of printed circuits, removal of conductive materials by chemical/electrolytic methods, and printed circuits, etc., can solve problems such as enlarged side erosion and non-conformity with design, saving product costs and satisfying industrial requirements. requirements, the effect of reducing the frequency of the parameters of the etching operation

Pending Publication Date: 2022-03-22
上海展华电子(南通)有限公司
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  • Abstract
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Problems solved by technology

[0003] In the etching process, side erosion will inevitably occur. Since chamfers (such as right angles) often appear in circuit graphics, the impact of side erosion will be amplified, so that the chamfers in the formed circuit graphics are mostly arc-shaped. , not as expected by the design

Method used

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  • Circuit board, manufacturing method thereof and electronic equipment
  • Circuit board, manufacturing method thereof and electronic equipment
  • Circuit board, manufacturing method thereof and electronic equipment

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Embodiment Construction

[0023] The technical solutions in the present application embodiment will be described in conjunction with the drawings in the present application embodiment. It will be appreciated that the specific embodiments described herein are intended to explain the present application, but not the limitation of the present application. It will also be described in that, in order to facilitate the description, only the parts related to the present application rather than all structures. Based on the embodiments in the present application, one of ordinary skill in the art is in the scope of the present application without making creative labor premistence.

[0024] The "Embodiment" mentioned herein means that the specific features, structures, or characteristics described in connection with the embodiments may be included in at least one embodiment of the present application. This phrase is not necessarily a separate or alternative embodiment of the same embodiment in each position in the sp...

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Abstract

The invention discloses a circuit board, a manufacturing method thereof and electronic equipment, and the manufacturing method of the circuit board comprises the steps: providing a circuit substrate which comprises a base layer and a conductive layer; covering an anti-corrosion layer on the conductive layer; wherein the anti-corrosion layer comprises a shielding area and a hollow area, and a chamfer formed by two adjacent edges in the shielding area is provided with a convex part which is convex outwards or a concave part which is concave inwards; and etching the conductive layer based on the etching pattern. Through the mode, the manufacturing precision of the circuit board is improved, and the product yield is improved.

Description

Technical field [0001] The present application relates to the technical field of board, and in particular, a circuit board and a manufacturing method thereof, an electronic device. Background technique [0002] In the production of the circuit board, the conductive layer (, such as a metal) on the circuit board is generally employed to form a required circuit graphic. [0003] Side erosion phenomenon occurs in the etching process, due to the case where the chamfer (such as right angle) is often chamfered (eg, right angle), the chamfer in the formed circuit pattern is placed in a circular arc shape. Do not meet the expected design. Inventive content [0004] In order to solve the above problems, the present application provides a circuit board and its production method, an electronic device, which can effectively solve the problem of unqualified circuit board size. [0005] In order to solve the above technical problems, the technical solution used in this application is to provi...

Claims

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Application Information

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IPC IPC(8): H05K3/06H05K1/02
CPCH05K3/061H05K1/0296
Inventor 陈胜胜孙书勇刘真银
Owner 上海展华电子(南通)有限公司
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