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Taiko ring removing method

A removal and ring shifting technology, which is applied in the fields of electrical components, semiconductor/solid-state device manufacturing, semiconductor/solid-state device testing/measurement, etc., can solve problems such as broken, affecting wafer processing, and ineffective removal of taiko rings, etc., to achieve The effect of reducing loss and stress

Active Publication Date: 2022-03-29
JIANGSU JCA ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Because the width of the Taiko ring is very small and the texture is relatively brittle, it is easy to break during the ring cutting, moving and positioning process. Once the Taiko ring is broken, it will not be automatically removed by the removal mechanism, and the existing removal process , there is no process of testing the integrity of the taiko ring before the taiko ring is removed. Therefore, the abnormality of the taiko ring cannot be found in time, which will easily cause the removal mechanism to work ineffectively, and if the taiko ring is not effectively removed, it will seriously Affect the subsequent processing of the wafer

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] The method for removing the Taiko ring disclosed by the present invention will be described below in conjunction with the accompanying drawings, as shown in the appended figure 1 , attached figure 2 As shown, the Taiko ring removal method is realized using various known devices. In this embodiment, the device includes a round table 5 for taking rings, on which a set of air passages (not shown in the figure) are formed, and one end of the air passages extends to the top of the round table 5 for taking rings. surface, the other end of the air channel extends to the bottom surface or outer circumference of the ring-taking platform 5 and is connected to a vacuum device (not shown in the figure) and an air supply device (not shown in the figure) through an external pipeline, The specific structures of the external pipeline, vacuum device and air supply device are known technologies, and will not be repeated here.

[0040] The outer circumference of the ring-taking round p...

Embodiment 2

[0068] This embodiment is similar to the overall process of the above-mentioned embodiment 1, the difference is: in this embodiment,

[0069] Before the Taiko ring 3 is removed from the wafer, the Taiko ring 3 is detected by a detection device, and the control device determines whether the Taiko ring is damaged according to the detection signal of the detection device;

[0070] When it is determined that the Taiko ring 3 is damaged, the control device sends an alarm and controls the removal mechanism not to remove the Taiko ring 3;

[0071] When it is determined that the Taiko ring 3 is not damaged, the control device controls the removing mechanism to remove the Taiko ring 3 .

[0072]That is, in this embodiment, as long as it is determined that the Taiko ring 3 is damaged, the alarm will be processed, regardless of whether the damaged Taiko ring 3 is still a whole. This method can ensure the investigation and timely treatment of abnormal conditions to the greatest extent, a...

Embodiment 3

[0074] Present embodiment is further designed on the basis of above-mentioned embodiment 1,2 as follows:

[0075] Each removal claw 1 of the removal manipulator 8 is provided with a sensor 2, and the sensor 2 is used to detect the amount of insertion of the removal claw 1 into the outer circumference of the Taiko ring 3, The protruding amount is the length of a part of the area inside the outer circumference of the Taiko ring 3 when the grabbing plate of the removal claw 1 is located below the Taiko ring 3, and the sensor 2 is connected to the control device (not shown in the figure), the control device controls a plurality of linear movement mechanisms according to the signals of each of the sensors 2, so that the removal claw 1 driven by each linear movement mechanism moves to a preset position (at the preset position, the length of the partial area where the grabbing plate extends into the outer circumference of the Taiko ring 3 is slightly smaller than the width of the Tai...

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PUM

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Abstract

The invention discloses a Taiko ring removing method, which comprises the following steps of: before removing a Taiko ring through a removing mechanism, detecting the Taiko ring through a detection device, and judging whether the Taiko ring is a whole or not by a control device according to a detection signal of the detection device; when it is determined that the Taiko ring is not a whole, the control device gives an alarm and controls the removing mechanism not to remove the Taiko ring; when it is determined that the Taiko ring is a whole, the control device controls the removing mechanism to remove the Taiko ring. According to the scheme, a mode of firstly detecting the integrity of the Taiko ring and then removing the Taiko ring is adopted, so that the action of the removing mechanism can be effectively controlled according to the actual condition of the Taiko ring, and an alarm can be given and manual processing can be reminded under the condition that the Taiko ring is not an integral body, so that the problem that the Taiko ring cannot be removed due to damage is avoided; and subsequent processing of the wafer cannot be carried out smoothly. Meanwhile, the invalid action of the removing mechanism can be avoided under the abnormal condition of the Taimao ring, and the loss can be reduced in time.

Description

technical field [0001] The invention relates to the field of wafer processing in the semiconductor industry, in particular to a Taiko ring removal method. Background technique [0002] When using the known Taiko thinning process for wafer processing, only the central area of ​​the wafer is thinned, and the unthinned part of the outer periphery of the wafer forms a ring-shaped Taiko ring to provide support for the thinner wafer , so as to facilitate the storage and movement of wafers. [0003] During the subsequent wafer processing, the Taiko ring on the wafer needs to be ring-cut, and then the wafer is fixed on the ring-taking platform and the ring-cut Taiko ring is removed from the wafer by the removal mechanism. When the removing mechanism removes the Taiko ring from the wafer, it is necessary to peel off the ring-cut Taiko ring from the film on the wafer and grab it, and then move the grabbed Taiko ring to the outside of the wafer. [0004] Because the width of the Taik...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/66H01L21/67
CPCH01L22/20H01L21/67288H01L21/67126H01L21/67092
Inventor 高金龙葛凡张宁宁周鑫蔡国庆
Owner JIANGSU JCA ELECTRONICS TECH CO LTD