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Taiko ring removal method

A removal and ring shifting technology, which is applied in semiconductor/solid-state device testing/measurement, electrical components, circuits, etc., can solve problems such as broken, affecting wafer processing, and failure to detect abnormalities of taiko rings in time, so as to reduce losses , the effect of small force

Active Publication Date: 2022-06-03
JIANGSU JCA ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Because the width of the Taiko ring is very small and the texture is relatively brittle, it is easy to break during the ring cutting, moving and positioning process. Once the Taiko ring is broken, it will not be automatically removed by the removal mechanism, and the existing removal process , there is no process of testing the integrity of the taiko ring before the taiko ring is removed. Therefore, the abnormality of the taiko ring cannot be found in time, which will easily cause the removal mechanism to work ineffectively, and if the taiko ring is not effectively removed, it will seriously Affect the subsequent processing of the wafer

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] The method for removing the drum ring disclosed by the present invention will be described below in conjunction with the accompanying drawings, as shown in the accompanying drawings. figure 1 , attached figure 2 As shown, the taiko ring removal method is implemented using various known devices. In this embodiment, the device includes a ring taking table 5 , a group of air passages (not shown in the figure) are formed on the ring taking table 5 , and one end of the air passage extends to the top of the ring taking table 5 The other end of the air passage extends to the bottom surface or the outer circumference of the ring-taking round table 5 and is connected to a vacuum device (not shown in the figure) and an air supply device (not shown in the figure) through an external pipeline, The specific structures of the external pipeline, the vacuuming device and the air supplying device are known technologies, and are not described here.

[0040] The outer periphery of the ...

Embodiment 2

[0068] This embodiment is similar to the overall process of the above-mentioned Embodiment 1, and the difference is that in this embodiment,

[0069] Before removing the drum ring 3 from the wafer, the drum ring 3 is detected by a detection device, and the control device determines whether the drum ring is damaged according to the detection signal of the detection device;

[0070] When it is determined that the drum ring 3 is damaged, the control device issues an alarm and controls the removal mechanism not to remove the drum ring 3;

[0071] When it is determined that the drum ring 3 is not damaged, the control device controls the removal mechanism to remove the drum ring 3 .

[0072]That is to say, in this embodiment, only if it is determined that the taiko ring 3 is damaged, an alarm will be processed, regardless of whether the damaged taiko ring 3 is still a whole. This method can ensure the investigation and timely processing of abnormal situations to the greatest extent...

Embodiment 3

[0074] The present embodiment is further designed as follows on the basis of the above-mentioned embodiments 1 and 2:

[0075] A sensor 2 is provided on each removal claw 1 of the removal manipulator 8, and the sensor 2 is used to detect the insertion amount of the removal claw 1 into the inner side of the outer circumference of the drum ring 3, The protruding amount is the length of the part of the area inside the outer circumference of the drum ring 3 when the grab plate of the removal claw 1 is located under the drum ring 3, and the sensor 2 is connected to the control device (not shown in the figure), the control device controls a plurality of linear movement mechanisms according to the signal of each of the sensors 2, so that the removal claw 1 driven by each linear movement mechanism moves to a preset position (At the preset position, the length of the part of the area where the grabbing plate extends into the inner circumference of the outer circumference of the drum ri...

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PUM

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Abstract

The invention discloses a method for removing a taiko ring. Before the removal of the taiko ring by a removal mechanism, the taiko ring is detected by a detection device, and the control device judges whether the taiko ring is a whole according to the detection signal of the detection device. ; When it is determined that the Taiko ring is not a whole, the control device sends an alarm and controls the removal mechanism not to remove the Taiko ring; when it is determined that the Taiko ring is a whole, the control device controls the removal mechanism to remove the Taiko ring. This solution adopts the method of detecting the integrity of the taiko ring first, and then removing it, which can effectively control the action of the removal mechanism according to the actual situation of the taiko ring, and can give an alarm when the taiko ring is not a whole. In order to avoid the problem that the wafer cannot be processed smoothly due to the damage of the Taiko ring and cannot be removed. At the same time, it can avoid the invalid action of the removal mechanism under the abnormal condition of the taiko ring, which is beneficial to reduce the loss in time.

Description

technical field [0001] The present invention relates to the field of wafer processing in the semiconductor industry, in particular to a method for removing a drum ring. Background technique [0002] During wafer processing using the known Taiko thinning process, only the central area of ​​the wafer is thinned, and the non-thinned part of the outer periphery of the wafer forms a ring-shaped drum ring to provide support for the thinner wafer , so as to facilitate the storage and movement of wafers. [0003] During subsequent wafer processing, it is necessary to perform a circumcision on the taiko ring on the wafer, and then fix the wafer on the ring taking table and remove the ring cut from the wafer through the removal mechanism. When the removal mechanism removes the taiko ring from the wafer, it is necessary to first peel off the ring cut from the film on the wafer and grasp it, and then move the grasped taiko ring to the outside of the wafer. [0004] Because the width o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/66H01L21/67
CPCH01L22/20H01L21/67288H01L21/67126H01L21/67092
Inventor 高金龙葛凡张宁宁周鑫蔡国庆
Owner JIANGSU JCA ELECTRONICS TECH CO LTD