Wafer box, bearing device and taking and placing device thereof, and semiconductor processing equipment
A technology of a carrying device and a pick-and-place device, which is used in semiconductor/solid-state device manufacturing, transportation and packaging, electrical components, etc., can solve problems such as scratches, bump damage, and dirt on the surface of the substrate, and achieve the effect of avoiding damage.
Active Publication Date: 2022-04-05
华芯半导体研究院(北京)有限公司 +1
View PDF11 Cites 2 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0002] With the continuous expansion of the semiconductor industry, the number of substrates, semi-finished products and finished products used has increased sharply, and the requirements for the cassettes required for storage have also continued to increase. The existing cassettes are integrally formed by molds and composed of support tables on both sides. , the substrates are placed layer by layer, and the middle interval is small and fixed. When picking and placing the substrate, semi-finished products and finished products, it often causes scratches, dirt, bump damage, etc. on the surface of the substrate.
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0053] In order to enable those skilled in the art to better understand the technical solutions of the present invention, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.
[0054] Such as figure 1 and figure 2 As shown, one aspect of the present invention provides a chip box 100, the chip box 100 includes a rear cover 110 and a front cover 120 covered on the rear cover 110, the chip box 100 also includes image 3 As shown in the carrying device 200, the carrying device 200 is movably arranged in the film box 100; and / or, the film box 100 also includes such as Figure 10 The pick-and-place device 300 is shown, and the pick-and-place device 300 is accommodated in the cassette 100 . That is to say, only the carrying device 200 may be placed in the chip box 100, or only the pick-and-place device 300 may be placed, or both the carrying device 200 and the pick-and-place device 300 may be placed...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention provides a wafer box, a bearing device and a pick-and-place device thereof, and semiconductor processing equipment, the bearing device comprises a plurality of bearing assemblies and at least one lifting mechanism which are oppositely arranged at intervals, and the plurality of bearing assemblies are used for being movably arranged in the wafer box; the lifting mechanism is connected with the multiple bearing assemblies, and the lifting mechanism can enable the multiple bearing assemblies to ascend and descend so as to adjust the distance between the multiple bearing assemblies. According to the bearing device disclosed by the invention, by adjusting the distance among the plurality of bearing assemblies, scratches, smudginess, collision damage and misplaced placement on the surfaces of the wafers can be well avoided when the wafers are taken and placed from the bearing device of the wafer box, the surfaces of the wafers are effectively protected, and damage is avoided.
Description
technical field [0001] The invention belongs to the technical field of semiconductors, and in particular relates to a chip box, a carrying device, a pick-and-place device, and semiconductor processing equipment. Background technique [0002] With the continuous expansion of the semiconductor industry, the number of substrates, semi-finished products and finished products used has increased sharply, and the requirements for the cassettes required for storage have also continued to increase. The existing cassettes are integrally formed by molds and composed of support tables on both sides. , The substrates are placed layer by layer, with small and fixed intervals between them. When picking and placing substrates, semi-finished products and finished products, scratches, dirt, bump damage, etc. are often caused on the surface of the substrate. [0003] In view of the above-mentioned problems, it is necessary to propose a chip cassette, its carrying device, pick-and-place device,...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/677H01L21/687
Inventor 曹鑫尧舜胡斌刘晨晖董国亮康联鸿陈章龙冒凯汤秀娟
Owner 华芯半导体研究院(北京)有限公司