Packaging structure and manufacturing method for packaging structure

Abstract

The invention relates to the technical field of chip packaging, and discloses a packaging structure, which comprises a to-be-packaged substrate used for supporting a to-be-packaged filter chip; the filter chip to be packaged is welded on the substrate to be packaged in an inverted manner; the isolation layer is arranged on one side, close to the filter chip to be packaged, of the substrate to be packaged; and the plastic packaging layer, the filter chip to be packaged, the substrate to be packaged and the isolation layer enclose to form a cavity. Thus, the isolation layer is arranged on the side, close to the to-be-packaged filter chip, of the to-be-packaged substrate, and the volatile organic matter dielectric material and the solder resist material are blocked through the isolation layer under the condition of high temperature, so that the organic matter dielectric material and the solder resist material cannot be attached to the to-be-packaged filter chip, and frequency deviation of the filter cannot be caused; and the filter has high reliability. The invention further discloses a manufacturing method for the packaging structure.

Description

technical field [0001] The present application relates to the technical field of chip packaging, for example, to a packaging structure and a manufacturing method for the packaging structure. Background technique [0002] The package of the filter usually has a cavity. Currently, the wafer containing the filter chip to be packaged is cut into individual filter chips to be packaged, and then the single filter chip to be packaged is flip-chip welded on the substrate to be packaged, and then A cavity is formed by enclosing the filter chip to be packaged and the substrate to be packaged by the plastic sealing film. However, 250-degree reflow soldering is involved in the customer-end assembly process of the filter. The high temperature makes the organic dielectric material and solder resist material of the substrate to be packaged easily volatilize and adhere to the filter chip to be packaged, causing the filter The frequency offset of the filter makes the filter reliability low....

AI Technical Summary

Problems solved by technology

However, 250-degree reflow soldering is involved in the customer-end assembly process of the filter. The high temperature makes the organic dielectric material and solder resist material of the substrate to be packaged easily volatilize and adhere to the filter chip to be packaged, causing the filter filter frequency offset, making the filter less reliable

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