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Manufacturing method of pseudo rigid-flex board and pseudo rigid-flex board

A technology of rigid-flex boards and manufacturing methods, which is applied to the structural connection of printed circuits, printed circuit components, and assembly of printed circuits with electrical components, which can solve problems such as high cost and difficult processing, and achieve good supportability , Reduce the effect of processing difficulty

Pending Publication Date: 2022-04-05
SHENZHEN SHIRUITAI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The main purpose of the present invention is to propose a method for making a pseudo-rigid-flex board and a pseudo-rigid-flex board, aiming to solve the problem that the existing flexible circuit board is designed as a rigid-flex board for processing, resulting in high processing difficulty, high cost

Method used

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  • Manufacturing method of pseudo rigid-flex board and pseudo rigid-flex board
  • Manufacturing method of pseudo rigid-flex board and pseudo rigid-flex board
  • Manufacturing method of pseudo rigid-flex board and pseudo rigid-flex board

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Embodiment Construction

[0047] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0048] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relationship between the components in a certain posture (as shown in the figure). Relative positional relationship, movement conditions, etc., if the specific posture changes, the directional indication will also change accordingly.

[0049] In addition, in the present inve...

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Abstract

The invention discloses a manufacturing method of a pseudo rigid-flexible combined board, and the method comprises the steps: providing a flexible circuit board, an adhesive layer, and a rigid reinforced circuit board, the flexible circuit board is provided with a first plug-in hole, the adhesive layer is provided with an adhesive layer through hole, and the rigid reinforced circuit board is provided with a second plug-in hole; enabling the center of the first plug-in hole to correspond to the center of the glue layer through hole and the center of the second plug-in hole, attaching a glue layer to the rigid reinforced circuit board, then attaching the rigid reinforced circuit board to the flexible circuit board, and carrying out rapid pressing to form a laminated circuit board; performing hot air leveling processing on the laminated circuit board to form a pseudo rigid-flexible combined board; by adopting the method, the pseudo rigid-flexible combined board can be manufactured; by reasonably designing the pattern of the flexible circuit board, the pattern of the adhesive layer and the pattern of the rigid reinforcing circuit board and setting the processing technology, the pseudo rigid-flexible combined board manufacturing method and the product which are simple in design and simple in processing are formed, the processing difficulty is effectively reduced, and the costs of materials, time, manpower and the like are saved.

Description

technical field [0001] The invention relates to the field of circuit boards, in particular to a method for manufacturing a pseudo-rigid-flex board and a pseudo-rigid-flex board. Background technique [0002] Flexible circuit boards generally play the role of connectivity, but for some fine electronic products, flexible circuit boards sometimes also play a load-bearing role, that is, the surface of flexible circuit boards also needs to be welded with electronic components, so as to improve product functions and space utilization rate. [0003] For electronic components that require strong support, it is necessary to design plug-in holes on the circuit board, and then solder to realize the fixation of components. For flexible circuit boards that require load-bearing performance, the design of plug-in holes is also available. [0004] Plug-in holes generally have a large diameter (generally 0.5mm to 2.0mm), and the inserted and soldered electronic components are relatively lar...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/36H05K1/14
Inventor 郭秀冬张涛李冬兰王文剑丁克渝
Owner SHENZHEN SHIRUITAI TECH
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