Wafer production parameter acquisition method and device, equipment and storage medium

A technology of production parameters and acquisition methods, applied in the fields of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problem of no production parameter acquisition method, and achieve the effect of improving production efficiency, accuracy and speed

Pending Publication Date: 2022-04-08
赛美特科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

When making semiconductors, it is necessary to collect the production parameters when producing wafers through the equipment automation system (Equipment Automation Program, EAP). When there is a problem in production, for example, if the wafer is scrapped, it can be analyzed through the collected production parameters The root of the problem, but currently there is no better method for obtaining production parameters for the EAP system

Method used

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  • Wafer production parameter acquisition method and device, equipment and storage medium
  • Wafer production parameter acquisition method and device, equipment and storage medium
  • Wafer production parameter acquisition method and device, equipment and storage medium

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Embodiment Construction

[0049] In order to make the purpose, technical solutions and advantages of the embodiments of the present disclosure clearer, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only It is a part of the embodiments of the present disclosure, but not all of them. The components of the disclosed embodiments generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations. Accordingly, the following detailed description of the embodiments of the present disclosure provided in the accompanying drawings is not intended to limit the scope of the claimed disclosure, but merely represents selected embodiments of the present disclosure. Based on the embodiments of the present disclosure, all other embodiments obtained by those ski...

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Abstract

The invention provides a wafer production parameter acquisition method and device, equipment and a storage medium, and the method comprises the steps: querying a wafer identifier of a target wafer in a mapping table according to a position identifier and a batch identifier of a wafer in a machine, finding a corresponding production parameter according to the wafer identifier, and obtaining a schedule, and obtaining parameter identifiers of the parameters in the schedule according to the production parameters, obtaining parameter values of the target wafer corresponding to the parameter identifiers from the machine, obtaining the schedule according to the obtained parameter values and the production parameters, and generating a target production parameter table. In this way, the production parameter acquisition schedule matched with the target wafer in the current machine can be quickly determined, and the accuracy and speed of acquiring the production parameters corresponding to the wafers can be improved.

Description

technical field [0001] The present disclosure relates to the technical field of semiconductor production, and in particular, to a method, apparatus, device, and storage medium for obtaining parameters of wafer production. Background technique [0002] With the development of the times, semiconductors have gradually become more and more important as hardware basic raw materials for technological development. When manufacturing semiconductors, it is necessary to collect the production parameters of the wafers produced by the Equipment Automation Program (EAP). The root of the problem, however, there is currently no better way to obtain production parameters for the EAP system. SUMMARY OF THE INVENTION [0003] Embodiments of the present disclosure provide at least a method, apparatus, device, and storage medium for obtaining wafer production parameters. In this way, a production parameter acquisition schedule that matches the target wafer in the current machine can be quic...

Claims

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Application Information

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IPC IPC(8): H01L21/67
Inventor 吴保刚
Owner 赛美特科技有限公司
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