Preparation method of light alloy three-dimensional lattice sandwich structure based on high surface quality

A three-dimensional lattice and sandwich structure technology, which is applied in the field of preparation of three-dimensional lattice sandwich structures based on high surface quality light alloys, can solve the problems of reducing the overall strength of the three-dimensional lattice structure, limiting the lightweight degree of the three-dimensional lattice structure, etc. The probability of occurrence of small defects, the reduction of peak air pressure, and the effect of expanding the scope of application

Active Publication Date: 2022-04-12
HARBIN INST OF TECH
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Problems solved by technology

[0004] In order to solve the problem of the existing high-temperature inflation and diffusion connection technology, the thickness of the formed panel is usually two to three times the thickness of the core plate, which limits the lightweight of the three-dimensional lattice structure and reduces the overall strength of the three-dimensional lattice structure. problems, and then provide a method for preparing a three-dimensional lattice sandwich structure based on high surface quality lightweight alloys;

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  • Preparation method of light alloy three-dimensional lattice sandwich structure based on high surface quality
  • Preparation method of light alloy three-dimensional lattice sandwich structure based on high surface quality

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specific Embodiment approach 1

[0023] Specific implementation mode one: refer to Figure 1 to Figure 2 To illustrate this embodiment, this embodiment provides a method for preparing a three-dimensional lattice sandwich structure based on a light alloy with high surface quality, and the method is realized through the following steps:

[0024] Step 1: Fine-grained core plate processing; first select the fine-grained light-weight alloy plate with fine grains, and process the fine-grained light-weight alloy plate into a grid-shaped hollow structure according to the design plan by mechanical processing methods, and according to the design plan in the Ventilation holes are processed at the corresponding positions of the core board;

[0025] Step 2: Processing of the upper panel and the lower panel; the material of the upper and lower panels is selected from ordinary light alloy plates, and the upper panel and the lower panel are processed according to the outline of the fine-grained core board. There is no need t...

specific Embodiment approach 2

[0034] Specific implementation mode two: refer to Figure 1 to Figure 2 Describe this embodiment, this embodiment is to further limit the step 1 described in the specific embodiment 1. In this embodiment, the laser cutting method is used in the step 1 to process the fine-grained light alloy plate according to the requirements of the design plan. Grid-shaped hollow structure, and process air holes at the corresponding positions of the core board according to the design plan. Other compositions and method steps are the same as those in Embodiment 1.

specific Embodiment approach 3

[0035] Specific implementation mode three: refer to Figure 1 to Figure 2 Describe this embodiment, this embodiment is to further limit the step three described in the second specific embodiment, in this embodiment, in the step three, 180 mesh, 240 mesh, 400 mesh, 800 mesh, 1200 mesh and 1500-grit sandpaper is used to polish the surface of the upper panel, the lower panel and the fine-grained core board, and each surface of the lower surface of the upper panel, the upper surface of the lower panel and the fine-grained core board needs to be polished six times. Other compositions and method steps are the same as those in Embodiment 2.

[0036] Such setting is convenient to ensure that the surface of the plate body is smooth and smooth.

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Abstract

The invention discloses a preparation method of a three-dimensional lattice sandwich structure based on a high-surface-mass light alloy, belongs to the technical field of metal space lightweight complex structure forming, and aims to solve the problems that the lightweight degree of the three-dimensional lattice structure is limited due to the fact that the thickness of a formed panel is generally two to three times of the thickness of a core plate in a high-temperature inflation and diffusion bonding technology. According to the preparation method of the three-dimensional lattice sandwich structure based on the high-surface-mass light alloy, an adopted fine-grain core plate has low flow stress at high temperature, in the forming process, vertical tension provided by rib plates is small, and when three-dimensional lattices of the same structure are formed, the overall strength of the three-dimensional lattice structure is reduced. The peak air pressure is obviously reduced; when the three-dimensional lattice structure is formed by using the same air pressure, compared with a three-dimensional lattice structure formed by adopting a common core plate, the three-dimensional lattice structure has better surface quality, the application range of high-temperature inflation / diffusion bonding is expanded, and the high-temperature use performance of the three-dimensional lattice structure is not influenced.

Description

technical field [0001] The invention belongs to the technical field of metal space lightweight complex structure forming, and specifically relates to a method for preparing a three-dimensional lattice sandwich structure based on a high-surface-quality light alloy. Background technique [0002] The light alloy three-dimensional lattice structure is a new type of lightweight structure. Compared with the traditional honeycomb structure, the three-dimensional lattice structure has higher structural designability, and the shape and size of the supporting lattice can be designed and optimized according to actual application requirements. , density and distribution and other structural characteristics, and the overall lightweight effect of the three-dimensional lattice structure is better and more obvious. In addition, the lattice structure can also realize the interconnection of the hollow part in three-dimensional space, which can provide enough space for use and operation for fu...

Claims

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Application Information

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IPC IPC(8): B23P15/00
Inventor 王国峰周彤旭刘青李振伦康庆鑫
Owner HARBIN INST OF TECH
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