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Common electrostatic chuck for different substrates

A technology for electrostatic chucks and substrates, applied in the direction of holding devices, circuits, discharge tubes, etc. that apply electrostatic attraction

Pending Publication Date: 2022-04-19
APPLIED MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Attaching package substrates with current electrostatic chucks can be a challenge, as the unique properties of the substrate may require either a unipolar or bipolar attachment approach

Method used

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  • Common electrostatic chuck for different substrates
  • Common electrostatic chuck for different substrates
  • Common electrostatic chuck for different substrates

Examples

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Embodiment Construction

[0014] Before describing several exemplary embodiments of the disclosure, it is to be understood that the disclosure is not limited to the details of construction or process steps set forth in the following description. The disclosure is capable of other embodiments and of being practiced or being carried out in various ways.

[0015] As used in this specification and the appended claims, the term "substrate" refers to a surface or a portion of a surface on which a process is performed. Those skilled in the art will also understand that reference to a substrate may also refer to only a portion of a substrate unless the context clearly dictates otherwise.

[0016] As used herein, "substrate" refers to any substrate or surface of material formed on a substrate on which processing is performed. Examples of substrate surfaces on which processing may be performed include silicon, silicon oxide, strained silicon, silicon-on-insulator (SOI), carbon-doped silicon oxide, amorphous sil...

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PUM

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Abstract

An apparatus, method, and controller for electrostatic adsorption of various substrate materials are disclosed. Some embodiments of the present disclosure provide an electrostatic chuck with variable polarity and / or voltage. Some embodiments of the present disclosure provide electrostatic chucks that can be used as unipolar and bipolar electrostatic chucks. Some embodiments of the present disclosure provide a bipolar electrostatic chuck capable of compensating for a substrate bias and generating approximately equal suction forces at different electrodes.

Description

technical field [0001] Embodiments of the present disclosure generally relate to apparatus, methods, and controllers for electrostatically attaching substrates. Some embodiments of the present disclosure allow different substrate materials to be adsorbed without modification of the electrostatic chuck. Background technique [0002] Different types of substrates have different properties requiring the use of more than one type of electrostatic chuck for support during substrate processing. Existing electrostatic chucks (echucks) are limited to certain types of substrates and are not effective or compatible with other substrate types. [0003] Available electrostatic chucks are uniquely bipolar or unipolar. Attracting package substrates with current electrostatic chucks can be a challenge, as the unique properties of the substrates may require unipolar or bipolar adsorption methods. In some cases, a combination of adsorption methods can be used to desorb the substrate. [...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01J37/32H01L21/683H02N13/00
CPCH01J37/32697H01J37/32715H01L21/6833H02N13/00H01L21/683H01L21/6831
Inventor V·拉马钱德兰A·朱普迪S·巴布
Owner APPLIED MATERIALS INC
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