Cooling test assembly unit and aging cooling equipment

A technology for assembling units and cooling components, which is used in measurement devices, electronic circuit testing, and electrical measurement. It can solve problems such as the inability to meet high-power optical chip aging test requirements, avoid deformation, avoid misoperation, and ensure accuracy. Effect

Active Publication Date: 2022-04-22
上海菲莱测试技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a cooling test assembly unit and aging cooling equipment, which solves the technical problem that the aging equipment in the prior art cannot meet the requirements of high-power optical chip aging testing

Method used

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  • Cooling test assembly unit and aging cooling equipment
  • Cooling test assembly unit and aging cooling equipment
  • Cooling test assembly unit and aging cooling equipment

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Experimental program
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Embodiment

[0066] The embodiment of the present application discloses a cooling test assembly unit, which is used to provide a low-temperature and full-power environment to complete the testing of chips, especially the detection of optical chips, and this application is aimed at testing high-power chips , during the specific test, the chip is welded on the copper substrate, and then the assembled copper substrate is assembled in the unit for testing.

[0067] In one embodiment, as figure 1 , 2 As shown, the structure of the cooling test assembly unit includes:

[0068] Box 1, the box 1 is a sealed cavity 102 with an opening 101 on one side. The box 1 is composed of a plurality of plate-like parts, which can be welded or bolted. It is necessary to ensure that the cavity formed around In order to seal the cavity 102, so that the temperature environment inside the subsequent sealed cavity 102 will not be disturbed by the external environment; in order to further improve the cooling effect...

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PUM

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Abstract

The invention discloses a cooling test assembly unit and aging cooling equipment, and relates to the technical field of chip test.The test assembly unit comprises a box body, a cover plate, a cooling assembly, a protection plate and an electric connection assembly, the box body is a sealed cavity with an opening in one side, and the cover plate is hinged to the opening side of the box body to achieve opening and closing of the opening; the cooling assembly is mounted on the inner side of the sealing cavity; the protection plate is assembled above the cooling assembly, and a gap for assembling a to-be-detected piece is reserved between the bottom surface of the protection plate and the top surface of the cooling assembly; the electric connection assembly is installed on the side surface of the cooling assembly and is connected and conducted with the to-be-detected piece. The aging cooling equipment comprises the cooling test assembly unit. The technical problem that in the prior art, aging equipment cannot meet the aging test requirement of a high-power optical chip is solved.

Description

technical field [0001] The invention relates to the technical field of chip testing, in particular to a cooling test assembly unit and aging cooling equipment. Background technique [0002] Chip aging test is an electrical stress test method that uses voltage, high temperature or low temperature to accelerate the electrical failure of the device. The aging process basically simulates the entire life of the chip, because the electrical excitation applied during the aging process reflects the chip's working state. bad situation. [0003] Burn-in testing can be used as a test of device reliability or as a production window to discover early failures of devices. At present, the aging equipment on the market is usually aimed at the aging test of the high temperature environment, and cannot meet the aging test of the low temperature environment; When testing high-power optical chips, high-power optical chips are prone to light exposure due to long aging time. At the same time, l...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/28
CPCG01R31/2877
Inventor 张华薛银飞宁振坤
Owner 上海菲莱测试技术有限公司
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