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Semiconductor packaging structure

A packaging structure and semiconductor technology, which is applied to semiconductor devices, semiconductor/solid-state device components, and electric solid-state devices, etc., can solve the problems that heat is not easily exported, and the performance of chips 5 and electronic components 6 is affected.

Pending Publication Date: 2022-04-26
ADVANCED SEMICON ENG INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, since the heat generated by the power supply 7 is transmitted, the micro-bump 4 will be covered by the filling material 91, and the entire packaging structure will be covered by the molding layer 9, so the heat generated by the power supply 7 is not easy to be dissipated. And then affect the performance of chip 5 and electronic component 6

Method used

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  • Semiconductor packaging structure
  • Semiconductor packaging structure
  • Semiconductor packaging structure

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Embodiment Construction

[0029] The specific implementation manners of the present disclosure will be described below in conjunction with the accompanying drawings and examples. Those skilled in the art can easily understand the technical problems solved by the present disclosure and the technical effects produced through the contents recorded in this specification. It should be understood that the specific embodiments described here are only used to explain related inventions, rather than to limit the invention. In addition, for the convenience of description, only the parts related to the related invention are shown in the drawings.

[0030] It should be noted that the structures, proportions, sizes, etc. shown in the accompanying drawings of the specification are only used to match the content recorded in the specification for the understanding and reading of those skilled in the art, and are not intended to limit the implementation of the present disclosure. There are limited conditions, so it has...

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Abstract

According to the semiconductor packaging structure provided by the invention, the heat dissipation element located above the electronic element is divided into the first heat dissipation element (the power supply radiator) and the second heat dissipation element (the grounding radiator), and the first heat dissipation element and the second heat dissipation element are electrically isolated by using the insulating material. Wherein the first heat dissipation element extends to the substrate and is connected with a power supply circuit in the substrate, a power supply transmitted by the power supply circuit is guided to the first heat dissipation element through the surface of the substrate, and the power supply is transmitted to the back surface of the electronic element by utilizing the first heat dissipation element made of a metal material; and then the electric energy is transmitted to the electronic element through an electric connecting piece (or a silicon through hole in the electronic element) on the back surface so as to provide the electric energy required by the electronic element. Meanwhile, the heat generated by the operation of the power supply can be directly conducted through the first heat dissipation element and dissipated to the air, so that the heat generated by the operation of the power supply is prevented from influencing the performance of the electronic component in the semiconductor packaging structure.

Description

technical field [0001] The present disclosure relates to the technical field of semiconductors, and in particular to semiconductor packaging structures. Background technique [0002] Such as figure 1 As shown, the power supply 7 (power) required for the operation of the current semiconductor package structure is provided by the printed circuit board 1 below the chip 5, wherein the power supply 7 enters the printed circuit board 1 through the solder ball 2, and then passes through the chip 5 and the printed circuit board. The micro-bump 4 between the boards 1 enters the chip 5 to provide the electrical energy required for the operation of the chip 5, and the signal 8 (signal) generated by the operation of the chip 5 enters the printed circuit board 1 through the micro-bump 4, It is then electrically connected and signal-transmitted with other electronic components 6 disposed on the printed circuit board 1 , and finally completes the operation of the entire electronic device....

Claims

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Application Information

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IPC IPC(8): H01L23/14H01L23/367H01L23/373H01L23/528H01L23/538H01L23/18
CPCH01L23/14H01L23/367H01L23/3736H01L23/5286H01L23/5386H01L23/18
Inventor 朱富成
Owner ADVANCED SEMICON ENG INC
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