LED chip processing equipment
A technology for LED chips and processing equipment, which is applied to coatings, semiconductor devices, and devices for coating liquid on the surface, etc., which can solve problems such as low processing efficiency, cumbersome processing, and imperfect processing, and increase the scope of application , good consistency, and the effect of improving the efficiency of processing
Pending Publication Date: 2022-05-06
朱福生
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Problems solved by technology
[0003] At present, the process of glue sealing (glue encapsulation) in the manufacture of LED chips is not perfect, and the consistency of glue dispensing for different chips is not good, resulting in differences in the effect of glue sealing of different chips, so that after glue sealing, different chips, There are quality defects such as inconsistent brightness of the LED finished light source; in the dispensing process of the existing LED chip processing equipment, the dispensing and the die cannot be carried out at the same time, the processing process is more cumbersome, and the dispensing head can only be used with a corresponding chip "Point-to-point" dispensing, the processing efficiency is low, and the production and processing cycle is prolonged
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[0023] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described here, and those skilled in the art can make similar improvements without departing from the connotation of the present invention, so the present invention is not limited by the specific implementations disclosed below.
[0024] refer to Figure 1-5 , a kind of LED chip processing equipment, including an operation table 1, the top wall of the operation table 1 is slidably connected with a flat plate 9, the side wall of the flat plate 9 is symmetrically provided with a telescopic air curtain 10, and the...
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The LED chip processing equipment comprises an operation table, the top wall of the operation table is slidably connected with a U-shaped plate, the side wall of the U-shaped plate is symmetrically provided with telescopic air curtains, the side wall of the U-shaped plate is fixedly connected with a cylinder, the interior of the cylinder is slidably connected with a folding rod, and the bottom end of the folding rod is fixedly connected with a magnetic plug. A first cavity and a second cavity are symmetrically formed in the inner wall of the cylinder, a magnetic block a is in sealed sliding connection with the interior of the first cavity, a magnetic block b is in sealed sliding connection with the interior of the second cavity, a top plate is fixedly connected to the top end of the folding rod, a box body and a bottom block are fixedly connected to the bottom wall of the top plate, and a plurality of piezoelectric ceramics are fixed to the inner wall of the box body. By arranging the second rod, the third rod, the top plate and other structures, the glue pushes the multiple elastic air bags to gradually expand from bottom to top to extrude the corresponding piezoelectric ceramics, the glue in each elastic air bag is used for carrying out glue dripping packaging on the chip, the glue capacity of each time of glue dripping is certain, and the glue dripping packaging consistency is good.
Description
technical field [0001] The invention relates to the technical field of chip encapsulation processing, in particular to LED chip processing equipment. Background technique [0002] The LED chip is a solid-state semiconductor device. The heart of the LED is a semiconductor wafer. One end of the wafer is attached to a bracket, one end is the negative pole, and the other end is connected to the positive pole of the power supply, and the entire wafer is encapsulated by epoxy resin. Also known as LED light-emitting chip, it is the core component of LED lamp. Its main function is to convert electric energy into light energy. The main material of the chip is monocrystalline silicon, and the processing and manufacturing process of LED chip is mainly divided into pressure welding and sealing. , The sealing material is epoxy resin, which is heat-cured. [0003] At present, the process of glue sealing (glue encapsulation) in the manufacture of LED chips is not perfect, and the consiste...
Claims
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IPC IPC(8): H01L33/52B05C5/02B05C13/02
CPCH01L33/52B05C5/0208B05C5/0225B05C13/02H01L2933/005
Inventor 朱福生
Owner 朱福生