Power module and electronic equipment

Abstract

The invention discloses a power module and electronic equipment, the power module comprises a mold sealing body, a substrate assembly, a plurality of signal terminals and a chip, and the substrate assembly is made of a hard insulating material; the substrate assembly is partially wrapped in the mold sealing body and comprises a metal layer and a plurality of conductive parts, the conductive parts are connected to the same side of the metal layer, the far ends, away from the metal layer, of the conductive parts are provided with connecting parts, and at least the connecting parts are exposed out of the mold sealing body; the plurality of signal terminals are connected to the corresponding conductive pieces through the connecting parts, at least parts of the signal terminals are located on the outer side of the mold sealing body, and the signal terminals are used for being matched with an external PCB in an inserted mode; the chip and the conductive member are connected to the same side of the metal layer. According to the power module, the conductive piece which can be exposed out of the packaging body is arranged on the substrate assembly, and the installation step of the signal terminal can be carried out after the packaging step of the mold packaging body, so that the arrangement position of the signal terminal is not limited by a mold, and flexible installation of the signal terminal is realized.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a power module and electronic equipment. Background technology [0002] With the development of technology, power modules are more and more used in various electronic products. Miniaturization is one of the development trends of power modules. The power module is mainly composed of substrate, chip, signal terminal and die seal. In a typical packaging process, the substrate connected with the signal terminal and chip needs to be put into the die cavity formed by the upper die and the lower die, and then the packaging material is injected into the die cavity. After the packaging material is cured, the die seal is formed. In related technologies, in order to avoid interference between the signal terminal and the upper die, The signal terminals extend from the side (not the upper side) of the power module, and each signal terminal is arranged in turn along the length direc...

AI Technical Summary

Problems solved by technology

A power module is mainly composed of a substrate, a chip, a signal terminal and a mold seal. In a typical packaging process, the substrate connected with the signal terminal and the chip needs to be placed in the mold cavity formed by the upper mold and the lower mold. The packaging material is injected into the mold cavity, and the mold sealing body is formed after the packaging material is cured. In the related art, in order to avoid interference between the signal terminals and the upper mold, the signal terminals protrude from the side (not the upper side) of the power module. , and the signal terminals are arranged in sequence along the length or width of the power module, which requires the power module to leave enough space for the signal terminals in the length or width direction, which hinders the miniaturization of the power module

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