Aluminum-plastic film corner aluminum layer thickness testing method and cutting device thereof
A test method and cutting device technology, applied in positioning devices, mechanical thickness measurement, manufacturing tools, etc., can solve misleading design and adjustment of punching die top angle, inability to accurately observe changes in aluminum layer thickness, and inability to maintain aluminum-plastic film. Corner original appearance and other issues, to achieve the effect of improving accuracy and ensuring accuracy
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Embodiment 1
[0061] Based on the aluminum-plastic film punching system device provided in the above-mentioned specific embodiment, this embodiment provides a method for punching aluminum-plastic film. The method for punching aluminum-plastic film includes:
[0062] The aluminum-plastic film 8 with a width of 530 mm, a thickness of 152 μm and an aluminum layer thickness of 40 μm is preheated in an oven 1 at a temperature of 35° C. for 1.0 h, and then the preheated aluminum-plastic film 8 is transported to The punching system uses a punching speed of 10m / s to press the die 9 to the punch 10 to punch the preheated aluminum-plastic film 8. The punching depth of the aluminum-plastic film 8 is 7.5mm, and the inner pit size It is 99.5×498.5mm, and the size of the outer pit is 101.5×500.5mm.
[0063] Based on the cutting device for testing the thickness of the aluminum layer at the corner of the aluminum-plastic film provided in a specific embodiment above, this embodiment provides a method for te...
Embodiment 2
[0069] The difference between this embodiment and Embodiment 1 is that, in the method for punching pits of the aluminum-plastic film, the preheating temperature of the aluminum-plastic film 8 is 55° C., and the rest of the process parameters and operation steps are the same as those of Embodiment 1.
Embodiment 3
[0071] The difference between this embodiment and Embodiment 1 is that, in the method for punching pits of the aluminum-plastic film, the preheating temperature of the aluminum-plastic film 8 is 75° C., and the rest of the process parameters and operation steps are the same as those of Embodiment 1.
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