Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Manufacturing equipment for integrated circuit chip

A technology for manufacturing equipment and integrated circuits, which is applied in the field of manufacturing equipment for integrated circuit chips, can solve the problems of affecting the use efficiency, long pressure relief time, easy to fall off, etc., and achieve the effect of convenient adjustment and use, ensuring stability and ensuring safety

Pending Publication Date: 2022-05-13
曹妮
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, in the existing negative pressure adsorption manufacturing equipment, most of the manipulator structures are directly installed on the mobile seat through sliding connection. When the adsorption force is small, it is easy to fall off. When the adsorption force is large, not only the pumping time is long, but also the pressure release time is long, which is not conducive to rapid relaxation and affects the use efficiency. At the same time, the existing equipment has poor freedom. It is not conducive to multi-directional transfer, and it is easy to cause distortion and interference of the exhaust pipe, which needs to be improved

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Manufacturing equipment for integrated circuit chip
  • Manufacturing equipment for integrated circuit chip
  • Manufacturing equipment for integrated circuit chip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0032] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention; obviously, the described embodiments are only some of the embodiments of the present invention, not all of them, based on The embodiments of the present invention and all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0033] see Figure 1-5 , a manufacturing apparatus for integrated circuit chips, comprising crossbar 1, see figure 1 , image 3 and Figure 4 , one end surface of the crossbar 1 is fixedly installed with a turning motor 11, which can turn over the angle with the installation ring 12, and then adjust the straight hollow bar 13 to the horizontal position, which is beneficial to place the raw material board to different positions, has high adapta...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses manufacturing equipment for integrated circuit chips, which comprises a cross rod, a turnover motor is fixedly mounted on the surface of one end of the cross rod, a mounting ring is rotatably mounted at the shaft end of the turnover motor, a hollow rod is rotatably mounted on the side surface of the mounting ring, and a disc is fixedly connected to the surface of one end of the hollow rod. An empty groove is formed in the surface of one side of the disc, a rubber adsorption pad is fixedly connected to the side face of the empty groove, a negative pressure adsorption hole is formed in the surface of the rubber adsorption pad, a connecting through hole is formed in the surface of the other side of the disc, and one end of the connecting through hole is aligned to one end of the negative pressure adsorption hole. And a pressing plate is slidably mounted on the surface of the hollow rod, a mounting screw is in threaded connection with the surface of the pressing plate, and a rubber push rod is in threaded connection with one end of the mounting screw, so that use convenience and stability can be greatly improved, and high efficiency and universality of transfer manufacturing are guaranteed.

Description

technical field [0001] The invention relates to the field of chip manufacturing, more specifically, to a manufacturing device for integrated circuit chips. Background technique [0002] In the manufacturing process of integrated circuit chips, it is necessary to transfer complete raw material plates to different stations for operation, and negative pressure adsorption equipment is commonly used. [0003] However, in the existing negative pressure adsorption manufacturing equipment, most of the manipulator structures are directly installed on the mobile seat through sliding connection. When the adsorption force is small, it is easy to fall off. When the adsorption force is large, not only the pumping time is long, but also the pressure release time is long, which is not conducive to rapid relaxation and affects the use efficiency. At the same time, the existing equipment has poor freedom. It is not conducive to multi-directional transfer, and it is easy to cause distortion a...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683
CPCH01L21/6838
Inventor 不公告发明人
Owner 曹妮
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com