Circuit board assembly and electronic equipment

A technology of circuit board components and electronic equipment, which is applied to printed circuit components, printed circuits, electrical components, etc., and can solve problems such as short circuits and low reliability of circuit board components

Pending Publication Date: 2022-05-13
HONOR DEVICE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when multilayer printed circuit boards are soldered, there is a risk of a short circuit between adjacent solder joints, resulting in lower reliability of the circuit board assembly

Method used

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  • Circuit board assembly and electronic equipment
  • Circuit board assembly and electronic equipment
  • Circuit board assembly and electronic equipment

Examples

Experimental program
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Embodiment Construction

[0056] In order to better understand the technical solutions of the present application, the embodiments of the present application will be described in detail below in conjunction with the accompanying drawings.

[0057] In a specific embodiment, the present application will be further described in detail below through a specific embodiment and in conjunction with the accompanying drawings.

[0058] Such as figure 1 as shown, figure 1 It is a schematic structural diagram of a circuit board assembly in the prior art. The circuit board assembly includes a plurality of boards 1' distributed along the thickness direction, and each board 1' includes a plurality of pads 2', and the adjacent pads 2' The space between them is insulated by an insulating member 4', so as to prevent short circuit between adjacent pads 2'. When adjacent boards 1' are welded, tin is filled between pads 2' of adjacent boards 1' to form solder joints 3' to realize welding. However, when the amount of tin...

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PUM

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Abstract

The invention relates to a circuit board assembly and electronic equipment, the circuit board assembly comprises a plurality of board bodies arranged along the thickness direction, the board bodies are provided with a plurality of bonding pads, and the bonding pads of the adjacent board bodies are welded; insulating parts are arranged between the adjacent bonding pads of the board body, the bonding pads are provided with first edges in the thickness direction of the circuit board assembly, the insulating parts are provided with second edges, and the second edges of at least part of the insulating parts exceed the first edges. When the second edge of the insulating part exceeds the first edge of the bonding pad, the space between the bonding pads of the adjacent board bodies which are mutually welded is increased, so that more filling tin can be accommodated between the bonding pads of the adjacent board bodies, and the risk of tin connection between the adjacent bonding pads caused by excessive tin flowing outwards when the amount of the filling tin is large is reduced; and the risk of tin connection caused by excessive tin between the bonding pads during welding of the adjacent board bodies due to incomplete tin removal of the repaired board bodies is reduced, the risk of short circuit caused by tin connection of the adjacent bonding pads is reduced, and the safety and reliability of the circuit board assembly are improved.

Description

technical field [0001] The present application relates to the technical field of electronic equipment, in particular to a circuit board assembly and electronic equipment. Background technique [0002] With the improvement of the performance specifications of various electronic equipment such as mobile phones, large screens, and computers, the number of electronic components used is increasing. Under the premise of not affecting the overall size of electronic equipment, multi-layer printed circuit boards ( Printed CircuitBoard, PCB) welding to form circuit board components. However, when multi-layer printed circuit boards are soldered, there is a risk of a short circuit between adjacent solder joints, resulting in lower reliability of the circuit board assembly. Contents of the invention [0003] The present application provides a circuit board assembly and electronic equipment, which can reduce the risk of tin short circuit between adjacent pads and improve the reliabilit...

Claims

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Application Information

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IPC IPC(8): H05K1/14H05K1/11
CPCH05K1/144H05K1/145H05K1/111
Inventor 史鹏飞黄秋育杨怀涛吕烨
Owner HONOR DEVICE CO LTD
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