Supercharge Your Innovation With Domain-Expert AI Agents!

Packaging structure, finished circuit board, electronic device, electronic equipment and soldering method

A technology for packaging structure and electronic devices, which is applied in the direction of electrical components, assembling printed circuits with electrical components, printed circuits, etc.

Active Publication Date: 2021-08-20
HUAWEI TECH CO LTD
View PDF10 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, by increasing the gap between the upper surface of the substrate and the bottom of the electronic device by thickening the stencil, the amount of tin in the solder joint increases, and the risk of tin connection is more likely to occur

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Packaging structure, finished circuit board, electronic device, electronic equipment and soldering method
  • Packaging structure, finished circuit board, electronic device, electronic equipment and soldering method
  • Packaging structure, finished circuit board, electronic device, electronic equipment and soldering method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0063] In order to make the technical solutions of the embodiments of the present application clearer, the terms involved in the embodiments of the present application are explained first.

[0064] PCB (Printed Circuit Board), the Chinese name is printed circuit board, also known as printed circuit board, is an important electronic component, a support for electronic devices, and a carrier for electrical connections of electronic devices. Because it is made using electronic printing, it is called a "printed" circuit board.

[0065] PCBA (Printed Circuit Board+Assembly), the Chinese name is the finished circuit board, which assembles various electronic devices on the circuit board through the surface packaging process to form a finished circuit board.

[0066] SiP (System in Package) packaging is a commonly used method for miniaturization of packaging devices. SiP packaging is to preferentially assemble multiple active electronic components with different functions and optiona...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

Embodiments of the present application provide a packaging structure, a finished circuit board, an electronic device, an electronic device, and a welding method. The packaging structure includes an electronic device and a substrate, and the electronic device and the substrate are electrically connected through solder joints formed by at least two layers of solder paste, wherein the materials of different layers of solder paste are different. The embodiment of the present application provides a packaging structure, which can increase the gap between the upper surface of the substrate and the bottom of the electronic device, effectively increase the filling amount of bottom gap filling glue or molding compound, and reduce the risk of tin connection between solder joints.

Description

technical field [0001] The embodiments of the present application relate to the field of electronic devices, and in particular to a packaging structure, a finished circuit board, an electronic device, an electronic device, and a welding method. Background technique [0002] As portable electronic products such as mobile phones and wearables become thinner and thinner and more functionally integrated, the energy consumption of electronic products is also increasing, so a large-capacity battery is required to improve battery life. In electronic products, in order to save space for placing large-capacity batteries, the components on the PCB are required to be miniaturized. SiP (System in Package) packaging is a common method for packaging device miniaturization. SiP packaging requires secondary plastic packaging to improve mechanical performance and environmental reliability. However, in some RF / WiFi SiP packages, some electronic devices with a size of 7mm×6mm or more are pac...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/18H05K3/34
CPCH05K1/181H05K3/341H05K3/3485
Inventor 胡天麒佘勇史洪宾
Owner HUAWEI TECH CO LTD
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com