Semiconductor packaging mold

Abstract

The invention discloses a semiconductor packaging mold, and relates to the related technical field of semiconductors. A packaging assembly is rotationally connected to the bottom of a transmission assembly, and screw screwing assemblies engaged with the transmission assembly are rotationally connected to the four corners of the surface of the packaging assembly; two intermittent moving screw supply assemblies are arranged in the mounting base in a sliding fit mode. Screw taking holes located in the inner sides of the limiting rings are formed in the four corners of the top of the mounting base correspondingly, and the screw screwing assembly sucks screws on the screw supply assembly to the bottom of the screw screwing assembly through the screw taking holes. The screws are magnetically adsorbed on the screw screwing assembly, after the packaging assembly moves downwards to the position where the screws are attached to the packaging holes in the packaging box, the screws at the four corners are driven to rotate through rotation of the transmission assembly at the same time, and then screwing and fixing of the screws on the packaging box are achieved; and under the elastic restoring force of the elastic resetting piece, the packaging assembly moves upwards and is reset, so that the packaging efficiency of the semiconductor is greatly improved.

Description

technical field [0001] The invention belongs to the technical field of semiconductors, and in particular relates to a semiconductor packaging mold. Background technique [0002] Semiconductors refer to materials with electrical conductivity between conductors and insulators at room temperature. Semiconductors are widely used in radios, televisions and temperature measurement, such as diodes. [0003] When a semiconductor is produced and shipped, it is usually necessary to package the semiconductor, so as to ensure that the semiconductor will not be damaged during subsequent transportation and sales. At present, when packaging semiconductors, the semiconductors are usually stacked in a packaging box, and then the packaging box cover is fixed on the packaging box. By arranging screws on the four corners of the packaging box cover, the stable packaging of the semiconductor is realized. [0004] However, in the process of implementing the specific embodiments of the present inv...

AI Technical Summary

Problems solved by technology

[0005] The object of the present invention is to provide a semiconductor packaging mold, through the design of the drive mechanism, transmission assembly, packaging assembly, screw screw assembly, screw supply assembly and push assembly, it solves the problem that the existing semiconductor packaging mold always needs in the packaging process. Manually place the screws on the bottom of the packaging mold, and then realize the tightening and fixing of the screws on the packaging box. The operation is cumbersome, which greatly reduces the packaging efficiency of semiconductors, and the automation of semiconductor packaging is low.

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