Semiconductor packaging mold

A semiconductor and mold technology, applied in the field of semiconductor packaging molds, can solve the problems of cumbersome operation, low degree of automation of semiconductor packaging, and reduced efficiency of semiconductor packaging, so as to achieve the effects of increasing automation, facilitating replacement, and improving packaging efficiency
CN114530389AInactive Publication Date: 2022-05-24苏永辉
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
苏永辉
Publication Date
2022-05-24
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses a semiconductor packaging mold, and relates to the related technical field of semiconductors. A packaging assembly is rotationally connected to the bottom of a transmission assembly, and screw screwing assemblies engaged with the transmission assembly are rotationally connected to the four corners of the surface of the packaging assembly; two intermittent moving screw supply assemblies are arranged in the mounting base in a sliding fit mode. Screw taking holes located in the inner sides of the limiting rings are formed in the four corners of the top of the mounting base correspondingly, and the screw screwing assembly sucks screws on the screw supply assembly to the bottom of the screw screwing assembly through the screw taking holes. The screws are magnetically adsorbed on the screw screwing assembly, after the packaging assembly moves downwards to the position where the screws are attached to the packaging holes in the packaging box, the screws at the four corners are driven to rotate through rotation of the transmission assembly at the same time, and then screwing and fixing of the screws on the packaging box are achieved; and under the elastic restoring force of the elastic resetting piece, the packaging assembly moves upwards and is reset, so that the packaging efficiency of the semiconductor is greatly improved.
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Description

technical field

[0001] The invention belongs to the technical field of semiconductors, and in particular relates to a semiconductor packaging mold. Background technique

[0002] Semiconductors refer to materials with electrical conductivity between conductors and insulators at room temperature. Semiconductors are widely used in radios, televisions and temperature measurement, such as diodes.

[0003] When a semiconductor is produced and shipped, it is usually necessary to package the semiconductor, so as to ensure that the semiconductor will not be damaged during subsequent transportation and sales. At present, when packaging semiconductors, the semiconductors are usually stacked in a packaging box, and then the packaging box cover is fixed on the packaging box. By arranging screws on the four corners of the packaging box cover, the stable packaging of the semiconductor is realized.

[0004] However, in the process of implementing the specific embodiments of the present inv...

Claims

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